M29W800FT70ZA3SF vs M29W800FB70ZA3SE Comparación
Comparación detallada lado a lado de M29W800FT70ZA3SF por Micron Technology y M29W800FB70ZA3SE por Micron Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Micron Technology
M29W800FT70ZA3SF - 8Mbit NOR Flash 70ns TFBGA48 | Micron
M29W800FT70ZA3SF ✓ ActivoMicron Technology
M29W800FB70ZA3SE - 8Mbit NOR Flash 70ns 48-TFBGA | Micron
M29W800FB70ZA3SE ObsoleteComparación de especificaciones
| Parámetro | M29W800FT70ZA3SF | M29W800FB70ZA3SE |
|---|---|---|
| Marca | Micron Technology | Micron Technology |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,05 | $1,12 |
| Tipo de memoria | NOR Flash | NOR Flash, Parallel |
| Density | 8 Mbit | — |
| Interfaz | Parallel | Parallel, address/data bus |
| Access Time | 70 ns | 70 ns |
| Tensión de alimentación | 2.7 V to 3.6 V | 3 V / 3.3 V (2.7 V to 3.6 V class) |
| Temperatura de funcionamiento | -40C to +125C | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 48-TFBGA (6 x 8 mm) | 48-TFBGA (6 x 8 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Boot Block Configuration | Top boot block (FT) | — |
| Memory Organization | [DATA_NEEDED: memory organization x8/x16] | — |
| Program/Erase Cycles | [DATA_NEEDED: endurance cycles] | — |
| Data Retention | [DATA_NEEDED: data retention years] | — |
| Active Read Current | [DATA_NEEDED: active read current] | [DATA_NEEDED: ICC read] |
| Standby Current | [DATA_NEEDED: standby current] | [DATA_NEEDED: ICC standby] |
| Package Body Size | 6 x 8 mm | — |
| Ball Pitch | 0.80 mm | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Tamaño de memoria | — | 8 Mbit |
| Organización de memoria | — | 1 M x 8 / 512 K x 16 |
| Technology | — | SLC NOR |
| Boot Block Architecture | — | Bottom boot block (FB) |
| Qualification | — | AEC-Q100 automotive |
| Packaging | — | Tray |
| Program/Erase Endurance | — | [DATA_NEEDED: endurance cycles] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL] |