M29W800FT70ZA3SF vs M29W800FB70ZA3SE 对比

详细并排对比 M29W800FT70ZA3SF 出自 Micron Technology 和 M29W800FB70ZA3SE 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Micron Technology
M29W800FT70ZA3SF M29W800FT70ZA3SF - 8Mbit NOR Flash 70ns TFBGA48 | Micron

M29W800FT70ZA3SF - 8Mbit NOR Flash 70ns TFBGA48 | Micron

M29W800FT70ZA3SF ✓ 量产中
Micron Technology
M29W800FB70ZA3SE M29W800FB70ZA3SE - 8Mbit NOR Flash 70ns 48-TFBGA | Micron

M29W800FB70ZA3SE - 8Mbit NOR Flash 70ns 48-TFBGA | Micron

M29W800FB70ZA3SE Obsolete

规格对比

参数 M29W800FT70ZA3SF M29W800FB70ZA3SE
品牌 Micron Technology Micron Technology
分类 Memory ICs Memory ICs
生命周期状态 有效 Obsolete
库存状态 有库存 有库存
单价(USD) $2.05 $1.12
存储器类型 NOR Flash NOR Flash, Parallel
Density 8 Mbit —
接口 Parallel Parallel, address/data bus
Access Time 70 ns 70 ns
电源电压 2.7 V to 3.6 V 3 V / 3.3 V (2.7 V to 3.6 V class)
工作温度 -40C to +125C [DATA_NEEDED: operating temperature range]
封装 48-TFBGA (6 x 8 mm) 48-TFBGA (6 x 8 mm)
安装类型 Surface Mount Surface Mount
Boot Block Configuration Top boot block (FT) —
Memory Organization [DATA_NEEDED: memory organization x8/x16] —
Program/Erase Cycles [DATA_NEEDED: endurance cycles] —
Data Retention [DATA_NEEDED: data retention years] —
Active Read Current [DATA_NEEDED: active read current] [DATA_NEEDED: ICC read]
Standby Current [DATA_NEEDED: standby current] [DATA_NEEDED: ICC standby]
Package Body Size 6 x 8 mm —
Ball Pitch 0.80 mm —
RoHS 状态 [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
存储容量 — 8 Mbit
存储组织 — 1 M x 8 / 512 K x 16
Technology — SLC NOR
Boot Block Architecture — Bottom boot block (FB)
Qualification — AEC-Q100 automotive
Packaging — Tray
Program/Erase Endurance — [DATA_NEEDED: endurance cycles]
Moisture Sensitivity Level — [DATA_NEEDED: MSL]

数据手册与资源

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