M7AFS600-1FGG256I vs M7AFS600-2FGG256 Comparación
Comparación detallada lado a lado de M7AFS600-1FGG256I por Microchip Technology y M7AFS600-2FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActivoMicrochip Technology
M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
M7AFS600-2FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-1FGG256I | M7AFS600-2FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $274,05 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion Mixed-Signal FPGA |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | ARM CoreMP7 |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | — |
| Configuration Memory | Flash (nonvolatile) | — |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | -2 |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Encapsulado / Carcasa | 256-Ball FBGA (FGG256) | — |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | Tray |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| User I/O | — | 119 |
| Dedicated Logic Bits | — | 110592 bits |
| Core Supply Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Technology | — | 130 nm flash-based |
| Configuration | — | Flash-based (nonvolatile, instant-on) |
| Encapsulado | — | 256-LBGA (FBGA-256, 17x17 mm) |
| Tipo de montaje | — | Surface Mount (SMD/SMT) |
| Temperatura de funcionamiento | — | 0C to +70C |
| Manufacturer Standard Lead Time | — | 16 Weeks (per Mouser, as of 2026-09-02) |
| Programmable Type | — | In-System Programmable (ISP) |
| Supplier Device Package | — | 256-FBGA |