M7AFS600-1FGG256I vs M7AFS600-2FGG256 비교
다음의 상세 나란히 비교: M7AFS600-1FGG256I 제조: Microchip Technology 및 M7AFS600-2FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ 활성Microchip Technology
M7AFS600-2FGG256 - 600K Gate Fusion FPGA with ARM | Microchip
M7AFS600-2FGG256 ✓ 활성사양 비교
| 파라미터 | M7AFS600-1FGG256I | M7AFS600-2FGG256 |
|---|---|---|
| 브랜드 | Microchip Technology | Microchip Technology |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | 활성 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $274.05 |
| Family | Fusion (Mixed-Signal Flash FPGA) | Fusion Mixed-Signal FPGA |
| System Gates | 600K | 600K |
| Processor Core | ARM CoreMP7 | ARM CoreMP7 |
| Number of I/O | 119 | — |
| 동작 공급 전압 | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | — |
| Configuration Memory | Flash (nonvolatile) | — |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | -2 |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| 패키지 / 케이스 | 256-Ball FBGA (FGG256) | — |
| 장착 스타일 | SMD/SMT | — |
| Packaging | Tray | Tray |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| RoHS 상태 | [DATA_NEEDED: RoHS status] | — |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| User I/O | — | 119 |
| Dedicated Logic Bits | — | 110592 bits |
| Core Supply Voltage | — | 1.5 V (1.425 V to 1.575 V) |
| Technology | — | 130 nm flash-based |
| Configuration | — | Flash-based (nonvolatile, instant-on) |
| 패키지 | — | 256-LBGA (FBGA-256, 17x17 mm) |
| 실장 유형 | — | Surface Mount (SMD/SMT) |
| 동작 온도 | — | 0C to +70C |
| Manufacturer Standard Lead Time | — | 16 Weeks (per Mouser, as of 2026-09-02) |
| Programmable Type | — | In-System Programmable (ISP) |
| Supplier Device Package | — | 256-FBGA |