M7AFS600-FGG256I vs AFS600-FGG256I Comparación
Comparación detallada lado a lado de M7AFS600-FGG256I por Microchip Technology y AFS600-FGG256I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-FGG256I - 600K-Gate Mixed-Signal FPGA | Microchip
M7AFS600-FGG256I ✓ ActivoMicrochip Technology
AFS600-FGG256I - 600K Gate Fusion FPGA | Microchip Technology
AFS600-FGG256I ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-FGG256I | AFS600-FGG256I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Family | Fusion Mixed-Signal FPGA | — |
| System Gates | 600K | 600,000 gates |
| User I/O | 119 | — |
| Encapsulado | 256-LBGA (FBGA), 1 mm ball pitch | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm | 130 nm CMOS |
| Maximum System Frequency | 1098.9 MHz (per distributor parametric listing) | — |
| Embedded Processor | ARM CoreMP7 | — |
| Fabric Type | Flash-based, non-volatile, instant-on | — |
| Analog Subsystem | Integrated configurable analog (per Microchip Fusion family page) | — |
| On-chip Flash Memory | Yes (large flash memory blocks, per Microchip Fusion family page) | — |
| Clock Management | Integrated clock generation and management circuitry (PLLs) | Comprehensive clock generation and management circuitry |
| Temperature Grade | Industrial (I suffix) | Industrial |
| Rango de temperatura de funcionamiento | -40C to +85C (industrial grade standard range) | — |
| Tipo de montaje | Surface Mount | — |
| Packaging | Tray | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Thermal Resistance (theta_JA) | [DATA_NEEDED: Thermal Resistance] | — |
| Device Type | — | Fusion mixed-signal FPGA |
| Metal Layers | — | 7 layers |
| Configuration Memory | — | Nonvolatile flash |
| Power-Up Configuration | — | Live at Power-Up (LAPU) |
| System Performance Frequency | — | 350 MHz |
| Tensión de alimentación | — | 1.5 V |
| Logic Family | — | CMOS |
| Total Pin Count | — | 256 pins |
| Package Type | — | BGA-256 |
| Package Pitch | — | 1.0 mm |
| Package Form | — | Square |
| Terminal Type | — | Ball |
| Temperatura de funcionamiento | — | 0°C to +70°C |
| Programmable Analog Resources | — | Configurable analog blocks |
| Embedded Flash | — | Large flash memory blocks |
| Programming Interface | — | [DATA_NEEDED: programming interface] |
| I/O Standards | — | [DATA_NEEDED: supported I/O standards] |
| Maximum I/O Current | — | [DATA_NEEDED: maximum I/O current] |
| Junction Temperature | — | [DATA_NEEDED: junction temperature rating] |