M7AFS600-FGG484I - Fusion FPGA 600K Gates 484-BGA | Microchip
N.º de pieza: M7AFS600-FGG484I ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $273.99 | $273,99 |
| 10 | $260.29 | $2.602,90 |
| 100 | $246.6 | $24.660,00 |
| 500 | $232.9 | $116.450,00 |
| 1.000 | $219.2 | $219.200,00 |
M7AFS600-FGG484I Descripción general
A mixed-signal FPGA is a field-programmable gate array that integrates analog and digital building blocks on a single die. In the system hierarchy, the AFS600 sits at the FPGA level of programmable logic devices (PLDs), above CPLDs in gate count, and uniquely combines FPGA fabric with microcontroller subsystem (MSS) functions, making it a programmable system-on-chip (SoC) rather than a pure logic device.
Key features of the M7AFS600-FGG484I include the ARM7TDMI-compatible CoreMP7 soft processor for embedded control, Flash-based configuration that retains programming through power cycles without external boot memory, and integrated analog peripherals characteristic of the Fusion family. The device operates from a 1.5V core supply with 3.3V-capable I/O banking. DigiKey lists the device as a Fusion FPGA IC with 172 I/O and 484-BGA packaging.
Architecturally, the Fusion family fabric is built on Microsemi (formerly Actel) Flash-based architecture, offering high design security because the bitstream is stored on-chip rather than loaded from external Flash at power-up. This also reduces bill-of-materials cost and improves resistance to design cloning compared with SRAM FPGAs.
Typical applications include industrial control, instrumentation with mixed analog/digital signal chains, motor and power supervision, medical device control boards, and aerospace/defense prototyping where single-chip programmable integration reduces board area and debug complexity.
A key design consideration is BGA soldering and rework: the 484-ball FGG package requires a controlled-impedance multilayer PCB with via-in-pad or doghouse fanout, and X-ray inspection is recommended for assembly qualification.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and procurement guidance not found in the manufacturer datasheet. Pricing is as of 2026-09-02.
Alternativas directas para M7AFS600-FGG484I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con M7AFS600-FGG484I (mismo factor de forma y huella) — difiere en Package, Family, Operating Temperature, Process Technology, Speed Grade.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
M7AFS600-1FGG484I
✅ Sustitución directa✓ En stock
$228 / unidad
Ver hoja de datos →M7AFS600-1FGG484
✅ Sustitución directa✓ En stock
$200 / unidad
Ver hoja de datos →M7AFS600-2FGG484
✅ Sustitución directa✓ En stock
$210 / unidad
Ver hoja de datos →M7AFS600-FGG484
✅ Sustitución directa✓ En stock
$232.9 / unidad
Ver hoja de datos →M1AFS600-1FGG484
✅ Sustitución directa✓ En stock
$59.5 / unidad
Ver hoja de datos →M7AFS600-FGG484I Valores máximos y características eléctricas
| Programmable Logic Family | Fusion (Microsemi/Actel, now Microchip) |
| System Gates | 600000 gates |
| Embedded Processor | ARM CoreMP7 (ARM7TDMI-compatible) |
| User I/O | 172 I/O |
| Configuration Technology | Flash-based, on-chip |
| Core Supply Voltage | 1.5 V |
| Encapsulado | 484-BGA (FGG484), 1.0 mm ball pitch |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (industrial, I grade) |
| Memory - Listable Resource | 110592 (per DigiKey listing) |
| Programming Tool Chain | Microchip Libero SoC (formerly Actel Libero) |
Guía de configuración de pines de M7AFS600-FGG484I 484-bga (fgg484), 1.0 mm ball pitch
Configuración de pines para M7AFS600-FGG484I (encapsulado 484-bga (fgg484), 1.0 mm ball pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para M7AFS600-FGG484I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
M7AFS600-FGG484I es adecuado para 6 aplicacións: Industrial Control and Automation, Mixed-Signal Instrumentation, Power Supervision and Smart Power Control, Medical Device Control Boards, Aerospace and Defense Prototyping, Communications and Networking Line Cards.
Industrial Control and Automation
The M7AFS600-FGG484I fits industrial control boards that need deterministic logic, an embedded processor, and analog supervision in one chip. Its 600K system gates host motion-sequencing state machines and communication bridges, while the ARM CoreMP7 runs supervisory firmware; the industrial -40C to +100C grade covers factory-floor ambient extremes. Because configuration is Flash-based and on-chip, the controller boots instantly at power-up without external boot Flash, improving uptime and tamper resistance in unattended equipment. In a typical design, the FPGA fabric interfaces with sensors, drives I/O modules, and implements safety interlocks, while the MSS handles protocol stacks and diagnostics. The main trade-off versus a microcontroller-plus-CPLD approach is the need for BGA assembly capability, but the integration saves board area and reduces component count in control cabinets.
Recomendado
Mixed-Signal Instrumentation
Bench and field instruments benefit from the Fusion architecture because the AFS600 combines digital fabric with mixed-signal supervision capability on one die, simplifying trigger logic, data-path buffering, and self-monitoring of supply rails. The M7AFS600-FGG484I's 172 user I/Os provide enough pins to interface ADCs, DACs, front-panel controls, and communication ports simultaneously without external glue logic. The ARM CoreMP7 processor manages measurement sequencing and user interface while the fabric performs time-critical capture at hardware speed, a split that keeps timing jitter low for acquisition channels. Flash-based configuration means the instrument is ready immediately on power-up, an important user-experience factor. Designers should budget for the 1.5 V core rail and plan a multilayer stack-up with solid ground planes to protect analog sections from digital switching noise in the 484-BGA layout.
Recomendado
Power Supervision and Smart Power Control
The Fusion family was designed for power-monitoring applications, and the M7AFS600-FGG484I extends that capability to larger systems: its fabric can implement multiple PWM channels, sequencing logic, and fault-handling state machines, while the ARM CoreMP7 executes higher-level power-management policy. The Flash-based fabric retains configuration through brownouts and cold starts, which is essential for power-rail supervision where predictable behavior on every power-up is a safety requirement. With 172 user I/Os, one device can monitor dozens of rails and drive enable/gate signals across a backplane. Industrial temperature rating (-40C to +100C) suits telecom rectifiers, base-station power shelves, and industrial PSUs. The design consideration is deterministic fault response: keep fast overcurrent trip logic in the fabric rather than in software so that protection latencies are bounded by hardware, not interrupt latency.
Recomendado
Medical Device Control Boards
Medical diagnostic and monitoring equipment requires reliable single-chip control with verifiable configuration, and the M7AFS600-FGG484I addresses both needs. Its on-chip Flash configuration prevents bitstream interception or substitution, supporting design integrity requirements in regulated products, while the mixed-signal fabric supervises analog front-end power and sensor rails. The ARM CoreMP7 handles the device's application firmware, communication with host systems, and data formatting, while FPGA fabric implements deterministic interfaces to detectors, pumps, or display modules with microsecond-level timing. The 600K-gate capacity accommodates data-path pipelines for filtering and averaging of measurement channels. For medical designs, the 484-BGA package supports compact handheld or cart-based instruments, though BGA rework under quality systems requires controlled processes and X-ray inspection. Flash retention also means no reconfiguration risk during transport power cycles.
Recomendado
Aerospace and Defense Prototyping
Actel/Microsemi (now Microchip) programmable logic has a long heritage in aerospace and defense, and the M7AFS600-FGG484I serves as a low-cost prototyping and ground-support target for flight designs later ported to radiation-tolerant RTAX parts. The Flash-based fabric provides design security valued in defense programs because there is no external configuration bitstream to intercept, and configuration data survives radiation-adjacent ground environments and power anomalies. The 172 I/Os interface with legacy MIL-STD buses, sensor arrays, and telemetry links, while the ARM CoreMP7 runs housekeeping firmware on the same die. Teams prototyping for RTAX2000S or RTAX4000S flight parts can validate RTL and interfaces on the Fusion hardware first. Note the industrial grade is not space-qualified; use it for development, test equipment, and ground systems, not flight hardware.
Recomendado
Communications and Networking Line Cards
Line-card and backplane interfaces in industrial networking benefit from the M7AFS600-FGG484I's combination of 172 I/Os and hardware-timed fabric. The FPGA implements multi-port UART, SPI, parallel bus bridges, and custom serial protocols at line rate, while the ARM CoreMP7 manages network stacks, configuration, and status reporting. Flash-based boot eliminates external configuration devices on dense line cards, saving board space and removing a boot-failure failure mode. The industrial temperature grade supports telecom outdoor cabinets and unconditioned equipment rooms. Designers should plan the 484-BGA fanout with controlled-impedance routing for high-speed serial links and use the solid BGA ground grid to minimize ground bounce across the 1.0 mm ball pitch. For designs needing more logic than 600K gates, the pin-compatible M1AFS600-1FGG484 offers an upgrade path without PCB respin.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para M7AFS600-FGG484I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | M7AFS600-1FGG484I | M7AFS600-1FGG484 | M7AFS600-2FGG484 | M1AFS600-1FGG484 |
|---|---|---|---|---|---|
| Package | 484-BGA (FGG484) | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same | 484-BGA (FGG484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 gates | 600000 gates | 600000 gates | 600000 gates | Higher (M1 = 1M-class Fusion variant) |
| Speed Grade | Standard (base) | -1 (faster) | -1 (faster) | -2 (slower) | -1 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial | Commercial | Commercial |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
| Configuration | Flash-based, on-chip | Flash-based, on-chip | Flash-based, on-chip | Flash-based, on-chip | Flash-based, on-chip |
Diferenciadores clave
- Industrial temperature grade in a high-I/O BGA (frente a M7AFS600-FGG484)
- Faster speed grade available pin-to-pin (frente a M7AFS600-1FGG484I)
- Upgrade path to 1M-class logic without respin (frente a M1AFS600-1FGG484)
Notas de diseño
The 484-ball FGG484 package with 1.0 mm pitch requires a multilayer PCB (8+ layers recommended) with dedicated power and ground planes. Plan fanout with via-in-pad or doghouse escape routing before finalizing the board outline, and verify BGA escape with your fab's minimum trace/space rules. X-ray inspection of the assembly is recommended to confirm ball collapse and detect head-in-pillow defects. Thermal relief via arrays under the package center help dissipate die heat from the 1.5 V core rail.
The M7AFS600-FGG484I runs from a 1.5 V core supply with 3.3 V-capable I/O banks (exact rail set per the Fusion datasheet power section). Estimate core current by running Libero SmartPower analysis on your actual design - current scales with clock rate and toggle activity, so budgeting from datasheet worst-case alone often over-designs the regulator. Sequence rails per the datasheet power-up requirements, and add bulk plus local decoupling at each I/O bank to control simultaneous-switching noise across the 172 I/Os.
Three common pitfalls with this part: (1) assuming SRAM-FPGA workflows - the Fusion fabric is Flash-based, so there is no external bitstream loading; programming uses Libero SoC with the FlashPro programmer. (2) Migrating between speed grades (M7AFS600-FGG484I to M7AFS600-1FGG484I) without re-running timing closure in Libero - the -1 grade changes timing arcs. (3) Specifying the commercial-grade M7AFS600-FGG484 in place of the 'I' industrial grade in designs exposed below 0C or above +70C ambient.
Información de cumplimiento
Compliance status not stated in the verified distributor listings. Obtain the Microchip certificate of conformity for the exact ordering code M7AFS600-FGG484I before RoHS/REACH-relevant production.
