MC34903CP5EK vs MC34903CP3EK Comparación
Comparación detallada lado a lado de MC34903CP5EK por NXP Semiconductors y MC34903CP3EK por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC34903CP5EK - 5V/400mA SBC with HS-CAN, 32-SOIC | NXP
MC34903CP5EK ⚠ Última compraNXP Semiconductors
MC34903CP3EK - System Basis Chip PMIC, 32-SOIC-EP | NXP
MC34903CP3EK ✗ Fin de vidaComparación de especificaciones
| Parámetro | MC34903CP5EK | MC34903CP3EK |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Specialized PMIC | Power Management |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,58 | $5,42 |
| Product Type | System Basis Chip (SBC) with dual LDO + HS-CAN | — |
| Number of LDOs | 2 | — |
| LDO Output Voltage | 5.0 V (typ) | 3.3 V (x2) |
| LDO Output Current (each) | 400 mA | — |
| Rango de tensión de entrada | 5.5 V to 28 V | — |
| Load Dump Tolerance | 40 V (max) | — |
| Quiescent Current (standby) | 2 mA (typ) | — |
| Number of Wake-up Inputs | 3 | — |
| CAN Interface | High-Speed CAN (ISO 11898-2/5), up to 1 Mbaud | 1 Mbps, ISO 11898 compliant |
| Communication Interface | SPI (control/status) | — |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C | — |
| Package Type | SOIC-32 (exposed pad, 7.5 mm body) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020) | 3 (168 hours) |
| Automotive Qualification | AEC-Q100 qualified | — |
| Estado RoHS | Compliant | Compliant |
| Función | — | System Basis Chip (SBC) - PMIC + CAN + LIN |
| Topología | — | Dual LDO + high-side switches + CAN/LIN transceivers |
| Número de salidas | — | 2 LDOs + multiple high-side drivers |
| LDO Output Current | — | 400 mA per LDO |
| LIN Interface | — | LIN 2.0 slave |
| Wake-up Inputs | — | 3 (cyclic and edge-triggered) |
| Supply Voltage Range | — | 9 V to 18 V nominal (5.5 V to 40 V transient) |
| Temperatura de funcionamiento | — | -40C to +125C |
| Encapsulado | — | 32-SOIC-EP (exposed pad) |
| Configuration Interface | — | SPI / SCI |
| Apagado térmico | — | Integrated |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |