MC7448VU1000LD vs MC7448VU1000ND Comparación
Comparación detallada lado a lado de MC7448VU1000LD por NXP Semiconductors y MC7448VU1000ND por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC7448VU1000ND - PowerPC G4 MPU 1GHz 1MB L2 | NXP | 360-FCCBGA
MC7448VU1000ND ✗ Fin de vidaComparación de especificaciones
| Parámetro | MC7448VU1000LD | MC7448VU1000ND |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $225,90 | $92,00 |
| Processor Type | MPC74xx PowerPC 32-Bit | MPC74xx PowerPC G4 32-Bit MPU |
| Core Architecture | PowerPC e600 | — |
| Frecuencia de reloj máxima | 1.0 GHz | — |
| Core Voltage (VDD) | 1.15 V | — |
| I/O Voltage | 1.8 V / 2.5 V | — |
| L1 Instruction Cache | 32 KB | — |
| L1 Data Cache | 32 KB | — |
| L2 Cache | 1 MB unified | 1 MB unified on-chip |
| Number of Cores | 1 | — |
| SIMD Engine | AltiVec (VMX) | AltiVec 128-bit vector unit |
| System Bus | MPX/60x 64-bit | — |
| Encapsulado / Carcasa | 360-FCCBGA (25x25 mm) | — |
| Temperatura de funcionamiento | 0 C to +105 C | [DATA_NEEDED: full industrial temperature range] |
| Tipo de montaje | Surface Mount (BGA socket or solder) | Surface Mount (BGA socket or reflow) |
| Packaging | Tray | Tray |
| Lead Free Status | Contains Lead | Lead Free |
| Estado RoHS | non-compliant (contains lead) | RoHS Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Part Series | — | MPC7448 |
| Core Count | — | 1 |
| Ancho del bus de datos | — | 32-bit (64-bit MPX/60x bus) |
| Core Frequency | — | 1.0 GHz |
| L1 Cache | — | 32 KB instruction + 32 KB data |
| Core Voltage | — | 1.0 V (typical) |
| Process Technology | — | 90 nm Silicon-on-Insulator (SOI) |
| Bus Interface | — | MPX/60x, up to 200 MHz |
| Encapsulado | — | 360-FCCBGA (25x25 mm) flip-chip |