MC9S08QD2MPC vs MC9S08QG4CFFE Comparación
Comparación detallada lado a lado de MC9S08QD2MPC por NXP Semiconductors y MC9S08QG4CFFE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QD2MPC | MC9S08QG4CFFE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,49 | $1,10 |
| Core | HCS08 (S08QD family) | — |
| Ancho del bus de datos | 8 bit | — |
| Instruction Set | HC08 with BGND extension | — |
| Program Memory | 2 KB Flash | — |
| RAM | 128 bytes | — |
| Maximum CPU Frequency | 16 MHz | — |
| Tensión de alimentación | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| ADC | 4-channel, 10-bit | — |
| General-Purpose I/O | 6 pins | — |
| Watchdog | Yes (COP with dedicated internal oscillator) | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Internal Clock | Yes (internal oscillator, no external crystal required) | — |
| Encapsulado | 8-pin PDIP (DIP-8) | 16-QFN-EP (5x5 mm), QFN EP |
| Tipo de montaje | Through-Hole | Surface Mount |
| Temperatura de funcionamiento | -40 C to +85 C | — |
| Packaging | Tube | Tray |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Frecuencia de reloj máxima | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |