MC9S08QD2MPC vs MC9S08QG4CFFE Comparação
Comparação detalhada lado a lado de MC9S08QD2MPC por NXP Semiconductors e MC9S08QG4CFFE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08QD2MPC | MC9S08QG4CFFE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Fim de vida |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1,49 | $1,10 |
| Core | HCS08 (S08QD family) | — |
| Largura do barramento de dados | 8 bit | — |
| Instruction Set | HC08 with BGND extension | — |
| Program Memory | 2 KB Flash | — |
| RAM | 128 bytes | — |
| Maximum CPU Frequency | 16 MHz | — |
| Tensão de alimentação | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| ADC | 4-channel, 10-bit | — |
| General-Purpose I/O | 6 pins | — |
| Watchdog | Yes (COP with dedicated internal oscillator) | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Internal Clock | Yes (internal oscillator, no external crystal required) | — |
| Encapsulamento | 8-pin PDIP (DIP-8) | 16-QFN-EP (5x5 mm), QFN EP |
| Tipo de montagem | Through-Hole | Surface Mount |
| Temperatura de operação | -40 C to +85 C | — |
| Packaging | Tube | Tray |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Frequência máxima de clock | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Status do ciclo de vida | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Faixa de temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |