MC9S08QD2MPC vs MC9S08QG4CFFE Comparaison
Comparaison détaillée côte à côte de MC9S08QD2MPC par NXP Semiconductors et MC9S08QG4CFFE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QD2MPC | MC9S08QG4CFFE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,49 | $1,10 |
| Core | HCS08 (S08QD family) | — |
| Largeur du bus de données | 8 bit | — |
| Instruction Set | HC08 with BGND extension | — |
| Program Memory | 2 KB Flash | — |
| RAM | 128 bytes | — |
| Maximum CPU Frequency | 16 MHz | — |
| Tension d'alimentation | 2.7 V to 5.5 V | 2.5 V / 3.3 V |
| ADC | 4-channel, 10-bit | — |
| General-Purpose I/O | 6 pins | — |
| Watchdog | Yes (COP with dedicated internal oscillator) | — |
| Debug Interface | Background Debug Mode (BDM) | — |
| Internal Clock | Yes (internal oscillator, no external crystal required) | — |
| Boîtier | 8-pin PDIP (DIP-8) | 16-QFN-EP (5x5 mm), QFN EP |
| Type de montage | Through-Hole | Surface Mount |
| Température de fonctionnement | -40 C to +85 C | — |
| Packaging | Tube | Tray |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Fréquence d'horloge maximale | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Statut du cycle de vie | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Plage de température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |