MC9S08QD4MSCR vs MC9S08QG4CFFE Comparación
Comparación detallada lado a lado de MC9S08QD4MSCR por NXP Semiconductors y MC9S08QG4CFFE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QD4MSCR | MC9S08QG4CFFE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,15 | $1,10 |
| Core | HCS08 (S08 core) | — |
| Ancho del bus de datos | 8 bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | 4KB (4K x 8) FLASH |
| RAM Size | 256 B | — |
| Encapsulado | 8-SOIC (SO-8) | 16-QFN-EP (5x5 mm), QFN EP |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| Rango de temperatura de funcionamiento | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| ADC | 10-bit, 4 channels | — |
| Timers | Two 16-bit TPM | — |
| Communication Interface | SCI (UART) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Frecuencia de reloj máxima | — | 20 MHz |
| Tensión de alimentación | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Estado del ciclo de vida | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |