MC9S08QD4MSCR vs MC9S08QG4CFFE Comparaison
Comparaison détaillée côte à côte de MC9S08QD4MSCR par NXP Semiconductors et MC9S08QG4CFFE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QD4MSCR | MC9S08QG4CFFE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,15 | $1,10 |
| Core | HCS08 (S08 core) | — |
| Largeur du bus de données | 8 bit | — |
| Maximum CPU Frequency | 16 MHz | — |
| Program Memory Size | 4 KB (4K x 8) Flash | 4KB (4K x 8) FLASH |
| RAM Size | 256 B | — |
| Boîtier | 8-SOIC (SO-8) | 16-QFN-EP (5x5 mm), QFN EP |
| Operating Voltage Range | 2.7 V to 5.5 V | — |
| Plage de température de fonctionnement | -40 C to +125 C | [DATA_NEEDED: operating temperature range] |
| ADC | 10-bit, 4 channels | — |
| Timers | Two 16-bit TPM | — |
| Communication Interface | SCI (UART) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint | — |
| Instruction Set | HC08 with added BGND instruction | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | — |
| Niveau MSL | [DATA_NEEDED: MSL Level] | — |
| Core Processor | — | S08 |
| Core Size | — | 8-Bit |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Fréquence d'horloge maximale | — | 20 MHz |
| Tension d'alimentation | — | 2.5 V / 3.3 V |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Statut du cycle de vie | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Number of I/O | — | [DATA_NEEDED: number of GPIO] |
| Data Converters | — | [DATA_NEEDED: on-chip data converter summary] |