MC9S08QD4MSCR vs MC9S08QG4CFFE Comparação

Comparação detalhada lado a lado de MC9S08QD4MSCR por NXP Semiconductors e MC9S08QG4CFFE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08QD4MSCR MC9S08QD4MSCR - 8-bit S08 MCU, 4KB Flash, 16MHz | NXP

MC9S08QD4MSCR - 8-bit S08 MCU, 4KB Flash, 16MHz | NXP

MC9S08QD4MSCR ✓ Ativo
NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Fim de vida

Comparação de especificações

Parâmetro MC9S08QD4MSCR MC9S08QG4CFFE
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $3,15 $1,10
Core HCS08 (S08 core) —
Largura do barramento de dados 8 bit —
Maximum CPU Frequency 16 MHz —
Program Memory Size 4 KB (4K x 8) Flash 4KB (4K x 8) FLASH
RAM Size 256 B —
Encapsulamento 8-SOIC (SO-8) 16-QFN-EP (5x5 mm), QFN EP
Operating Voltage Range 2.7 V to 5.5 V —
Faixa de temperatura de operação -40 C to +125 C [DATA_NEEDED: operating temperature range]
ADC 10-bit, 4 channels —
Timers Two 16-bit TPM —
Communication Interface SCI (UART) —
Debug Interface Background Debug Mode (BDM), single breakpoint —
Instruction Set HC08 with added BGND instruction —
Tipo de montagem Surface Mount Surface Mount
Status RoHS Compliant —
Nível MSL [DATA_NEEDED: MSL Level] —
Core Processor — S08
Core Size — 8-Bit
CPU Architecture — HCS08 CISC, HC08 instruction set with added BGND instruction
Frequência máxima de clock — 20 MHz
Tensão de alimentação — 2.5 V / 3.3 V
Package Code — HVQCCN
Package Shape — Square
Number of Terminals — 16
Terminal Form — No Lead
Temperature Grade — Industrial
Series — S08QG (QG Series, S08 Family)
Debug Features — Background debugging system, single breakpoint in-circuit plus two more on-chip
Packaging — Tray
Status do ciclo de vida — End of Life (per NXP product page)
Program RAM Size — [DATA_NEEDED: Program RAM size]
ADC Resolution — [DATA_NEEDED: ADC resolution and channels]
Number of I/O — [DATA_NEEDED: number of GPIO]
Data Converters — [DATA_NEEDED: on-chip data converter summary]

Fichas técnicas e recursos

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