MC9S08QG4CFFE vs S9S08QD4J2MSC Comparación
Comparación detallada lado a lado de MC9S08QG4CFFE por NXP Semiconductors y S9S08QD4J2MSC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP
S9S08QD4J2MSC ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08QG4CFFE | S9S08QD4J2MSC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,10 | $1,14 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Frecuencia de reloj máxima | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| Tensión de alimentación | 2.5 V / 3.3 V | [DATA_NEEDED: VDD range] |
| Encapsulado | 16-QFN-EP (5x5 mm), QFN EP | 8-SOIC (0.154", 3.90 mm width) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Manufacturer | — | NXP Semiconductors |
| Core Architecture | — | HCS08 (8-bit, HC08-compatible with BGND) |
| CPU Frequency | — | 16 MHz |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 256 bytes |
| Temperatura de funcionamiento | — | -40C to +125C (automotive grade) |
| AEC-Q100 Qualification | — | Qualified |
| Número de pines | — | 8 |
| General-Purpose I/O Pins | — | 4 (plus 1 input-only and 1 output-only pin) |
| ADC | — | On-chip ADC (channel count per datasheet) |
| Timers | — | On-chip timer(s) |
| Communication | — | SCI/SPI (per datasheet) |
| Debug Interface | — | Background Debug Mode (BDM) with breakpoints |
| Low-Power Modes | — | STOP and WAIT |
| Estado RoHS | — | [DATA_NEEDED: RoHS status] |