MC9S08QG4CFFE vs S9S08QD4J2MSC Comparação

Comparação detalhada lado a lado de MC9S08QG4CFFE por NXP Semiconductors e S9S08QD4J2MSC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Fim de vida
NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ Ativo

Comparação de especificações

Parâmetro MC9S08QG4CFFE S9S08QD4J2MSC
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Fim de vida Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $1,10 $1,14
Core Processor S08 —
Core Size 8-Bit —
CPU Architecture HCS08 CISC, HC08 instruction set with added BGND instruction —
Frequência máxima de clock 20 MHz —
Program Memory Size 4KB (4K x 8) FLASH —
Tensão de alimentação 2.5 V / 3.3 V [DATA_NEEDED: VDD range]
Encapsulamento 16-QFN-EP (5x5 mm), QFN EP 8-SOIC (0.154", 3.90 mm width)
Package Code HVQCCN —
Package Shape Square —
Number of Terminals 16 —
Terminal Form No Lead —
Temperature Grade Industrial —
Series S08QG (QG Series, S08 Family) —
Debug Features Background debugging system, single breakpoint in-circuit plus two more on-chip —
Tipo de montagem Surface Mount Surface Mount
Packaging Tray —
Status do ciclo de vida End of Life (per NXP product page) —
Program RAM Size [DATA_NEEDED: Program RAM size] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
Number of I/O [DATA_NEEDED: number of GPIO] —
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] —
Data Converters [DATA_NEEDED: on-chip data converter summary] —
Manufacturer — NXP Semiconductors
Core Architecture — HCS08 (8-bit, HC08-compatible with BGND)
CPU Frequency — 16 MHz
Program Memory (Flash) — 4 KB (4K x 8)
RAM — 256 bytes
Temperatura de operação — -40C to +125C (automotive grade)
AEC-Q100 Qualification — Qualified
Número de pinos — 8
General-Purpose I/O Pins — 4 (plus 1 input-only and 1 output-only pin)
ADC — On-chip ADC (channel count per datasheet)
Timers — On-chip timer(s)
Communication — SCI/SPI (per datasheet)
Debug Interface — Background Debug Mode (BDM) with breakpoints
Low-Power Modes — STOP and WAIT
Status RoHS — [DATA_NEEDED: RoHS status]

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