MC9S08QG4CFFE vs S9S08QD4J2MSC 비교

다음의 상세 나란히 비교: MC9S08QG4CFFE 제조: NXP Semiconductors 및 S9S08QD4J2MSC 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ 단종
NXP Semiconductors
S9S08QD4J2MSC S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC - 8-bit S08 MCU, 4KB Flash, 16MHz, Automotive | NXP

S9S08QD4J2MSC ✓ 활성

사양 비교

파라미터 MC9S08QG4CFFE S9S08QD4J2MSC
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 수명 종료 활성
재고 상태 In Stock In Stock
단가 (USD) $1.10 $1.14
Core Processor S08 —
Core Size 8-Bit —
CPU Architecture HCS08 CISC, HC08 instruction set with added BGND instruction —
최대 클록 주파수 20 MHz —
Program Memory Size 4KB (4K x 8) FLASH —
공급 전압 2.5 V / 3.3 V [DATA_NEEDED: VDD range]
패키지 16-QFN-EP (5x5 mm), QFN EP 8-SOIC (0.154", 3.90 mm width)
Package Code HVQCCN —
Package Shape Square —
Number of Terminals 16 —
Terminal Form No Lead —
Temperature Grade Industrial —
Series S08QG (QG Series, S08 Family) —
Debug Features Background debugging system, single breakpoint in-circuit plus two more on-chip —
실장 유형 Surface Mount Surface Mount
Packaging Tray —
수명 주기 상태 End of Life (per NXP product page) —
Program RAM Size [DATA_NEEDED: Program RAM size] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
Number of I/O [DATA_NEEDED: number of GPIO] —
동작 온도 범위 [DATA_NEEDED: operating temperature range] —
Data Converters [DATA_NEEDED: on-chip data converter summary] —
Manufacturer — NXP Semiconductors
Core Architecture — HCS08 (8-bit, HC08-compatible with BGND)
CPU Frequency — 16 MHz
Program Memory (Flash) — 4 KB (4K x 8)
RAM — 256 bytes
동작 온도 — -40C to +125C (automotive grade)
AEC-Q100 Qualification — Qualified
핀 수 — 8
General-Purpose I/O Pins — 4 (plus 1 input-only and 1 output-only pin)
ADC — On-chip ADC (channel count per datasheet)
Timers — On-chip timer(s)
Communication — SCI/SPI (per datasheet)
Debug Interface — Background Debug Mode (BDM) with breakpoints
Low-Power Modes — STOP and WAIT
RoHS 상태 — [DATA_NEEDED: RoHS status]

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