MC9S08QG4CFQE vs MC9S08QG4CFKE Comparación

Comparación detallada lado a lado de MC9S08QG4CFQE por NXP Semiconductors y MC9S08QG4CFKE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC9S08QG4CFQE MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control

MC9S08QG4CFQE - 20MHz 8-Bit MCU | NXP | Embedded Control

MC9S08QG4CFQE ✗ Fin de vida
NXP Semiconductors
MC9S08QG4CFKE MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MC9S08QG4CFKE - 8-bit MCU, 4KB Flash, 20MHz, 24-QFN | NXP

MC9S08QG4CFKE ✓ Activo

Comparación de especificaciones

Parámetro MC9S08QG4CFQE MC9S08QG4CFKE
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Fin de vida Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $1,71
Product Type 8-bit HCS08 microcontroller —
CPU Clock Speed 20 MHz —
Architecture HCS08, HC08 instruction set with added BGND instruction —
Flash Memory 4 KB (4K x 8) —
Supply Voltage Range 1.8 V to 3.6 V 1.8 V to 3.6 V
I/O Ports 6 ports 6 (per distributor listing)
Encapsulado 8-DFN-EP (4 mm x 4 mm) 24-QFN-EP (4x4 mm)
Package Type DFN with exposed pad —
Core 8-bit HCS08 central processing unit —
Debug Support Background debugging system —
Breakpoint Support Single breakpoint during in-circuit debugging plus two on-chip breakpoints —
Shipping Package Tray —
Estado RoHS RoHS compliant Compliant
Temperature Grade [DATA_NEEDED: operating temperature range] —
RAM [DATA_NEEDED: RAM size] [DATA_NEEDED: RAM size in bytes]
EEPROM [DATA_NEEDED: EEPROM size] —
Maximum GPIO [DATA_NEEDED: maximum GPIO count] —
Core Architecture — HCS08 (S08)
Core Size — 8-bit
Maximum CPU Clock — 20 MHz
Program Memory — 4 KB Flash (4K x 8)
Temperatura de funcionamiento — -40 C to +85 C
ADC — 10-bit (per LCSC listing)
Tipo de montaje — Surface Mount
Debug Interface — Background Debug Mode (BDM), single breakpoint
Instruction Set — HC08 with BGND instruction
Nivel MSL — [DATA_NEEDED: MSL level]

Hojas de datos y recursos

Examinar todos los productos Crear BOM Solicitar cotización