MC9S08QG4CFQE vs MC9S08QG4CFKE 对比
详细并排对比 MC9S08QG4CFQE 出自 NXP Semiconductors 和 MC9S08QG4CFKE 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08QG4CFQE | MC9S08QG4CFKE |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $1.71 |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Clock Speed | 20 MHz | — |
| Architecture | HCS08, HC08 instruction set with added BGND instruction | — |
| Flash Memory | 4 KB (4K x 8) | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Ports | 6 ports | 6 (per distributor listing) |
| 封装 | 8-DFN-EP (4 mm x 4 mm) | 24-QFN-EP (4x4 mm) |
| Package Type | DFN with exposed pad | — |
| Core | 8-bit HCS08 central processing unit | — |
| Debug Support | Background debugging system | — |
| Breakpoint Support | Single breakpoint during in-circuit debugging plus two on-chip breakpoints | — |
| Shipping Package | Tray | — |
| RoHS 状态 | RoHS compliant | Compliant |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size in bytes] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum GPIO | [DATA_NEEDED: maximum GPIO count] | — |
| Core Architecture | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| Maximum CPU Clock | — | 20 MHz |
| Program Memory | — | 4 KB Flash (4K x 8) |
| 工作温度 | — | -40 C to +85 C |
| ADC | — | 10-bit (per LCSC listing) |
| 安装类型 | — | Surface Mount |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with BGND instruction |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |