MC9S08QG4CFQE vs MC9S08QG4CFKE 비교
다음의 상세 나란히 비교: MC9S08QG4CFQE 제조: NXP Semiconductors 및 MC9S08QG4CFKE 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
사양 비교
| 파라미터 | MC9S08QG4CFQE | MC9S08QG4CFKE |
|---|---|---|
| 브랜드 | NXP Semiconductors | NXP Semiconductors |
| 카테고리 | Microcontrollers | Microcontrollers |
| 수명 주기 상태 | 수명 종료 | 활성 |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $0.00 | $1.71 |
| Product Type | 8-bit HCS08 microcontroller | — |
| CPU Clock Speed | 20 MHz | — |
| Architecture | HCS08, HC08 instruction set with added BGND instruction | — |
| Flash Memory | 4 KB (4K x 8) | — |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| I/O Ports | 6 ports | 6 (per distributor listing) |
| 패키지 | 8-DFN-EP (4 mm x 4 mm) | 24-QFN-EP (4x4 mm) |
| Package Type | DFN with exposed pad | — |
| Core | 8-bit HCS08 central processing unit | — |
| Debug Support | Background debugging system | — |
| Breakpoint Support | Single breakpoint during in-circuit debugging plus two on-chip breakpoints | — |
| Shipping Package | Tray | — |
| RoHS 상태 | RoHS compliant | Compliant |
| Temperature Grade | [DATA_NEEDED: operating temperature range] | — |
| RAM | [DATA_NEEDED: RAM size] | [DATA_NEEDED: RAM size in bytes] |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Maximum GPIO | [DATA_NEEDED: maximum GPIO count] | — |
| Core Architecture | — | HCS08 (S08) |
| Core Size | — | 8-bit |
| Maximum CPU Clock | — | 20 MHz |
| Program Memory | — | 4 KB Flash (4K x 8) |
| 동작 온도 | — | -40 C to +85 C |
| ADC | — | 10-bit (per LCSC listing) |
| 실장 유형 | — | Surface Mount |
| Debug Interface | — | Background Debug Mode (BDM), single breakpoint |
| Instruction Set | — | HC08 with BGND instruction |
| MSL 레벨 | — | [DATA_NEEDED: MSL level] |