MC9S12DT256VPVE vs MC9S12DG256CCPV Comparación
Comparación detallada lado a lado de MC9S12DT256VPVE por NXP Semiconductors y MC9S12DG256CCPV por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DT256VPVE NrndNXP Semiconductors
MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP
MC9S12DG256CCPV NrndComparación de especificaciones
| Parámetro | MC9S12DT256VPVE | MC9S12DG256CCPV |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,87 | $18,20 |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Maximum Bus Frequency | 25 MHz | — |
| Program Memory (Flash) | 256 KB | 256 KB (256K x 8) |
| RAM | 12 KB | — |
| EEPROM | 4 KB | — |
| Encapsulado | 112-LQFP (20x20 mm) | — |
| Operating Voltage | 2.5 V core / 5.0 V I/O (typical) | — |
| ADC | 2 x 8-channel, 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 | 8 channels |
| Enhanced Capture Timer Channels | 8 | — |
| SCI (UART) Interfaces | 2 (asynchronous) | — |
| GPIO / Digital I/O Lines | 20 discrete digital I/O lines | — |
| Temperature Grade | Industrial | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant (verify per lot) | Compliant |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| Nivel MSL | [DATA_NEEDED: MSL Level] | 3 (168 hours, JEDEC J-STD-020) |
| Lead-Free | Yes | — |
| Maximum CPU/Bus Frequency | — | 25 MHz |
| RAM Size | — | 12 KB |
| EEPROM Size | — | 4 KB |
| Number of I/O Lines | — | 91 |
| Supply Voltage Range | — | 2.97 V to 5.5 V (single 5 V supply) |
| Rango de temperatura de funcionamiento | — | -40 °C to +85 °C (industrial) |
| Encapsulado / Carcasa | — | 112-LQFP (20 x 20 mm) |
| Communication Interfaces | — | 2 x SCI, 2 x SPI, I2C, CAN 2.0 |
| Timers | — | Enhanced Capture Timer (ECT) + watchdog |
| On-chip Debug | — | Background Debug Mode (BDM) |