MC9S12DT256VPVE vs MC9S12DG256CCPV 对比

详细并排对比 MC9S12DT256VPVE 出自 NXP Semiconductors 和 MC9S12DG256CCPV 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC9S12DT256VPVE MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256VPVE - 16-bit HCS12 MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DT256VPVE Nrnd
NXP Semiconductors
MC9S12DG256CCPV MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV - HCS12 16-bit MCU, 256KB Flash, 112-LQFP | NXP

MC9S12DG256CCPV Nrnd

规格对比

参数 MC9S12DT256VPVE MC9S12DG256CCPV
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 不推荐新设计
库存状态 有库存 有库存
单价(USD) $25.87 $18.20
Core HCS12 (16-bit CISC) HCS12 (16-bit CISC)
Maximum Bus Frequency 25 MHz —
Program Memory (Flash) 256 KB 256 KB (256K x 8)
RAM 12 KB —
EEPROM 4 KB —
封装 112-LQFP (20x20 mm) —
Operating Voltage 2.5 V core / 5.0 V I/O (typical) —
ADC 2 x 8-channel, 10-bit 8-channel, 10-bit
PWM Channels 8 8 channels
Enhanced Capture Timer Channels 8 —
SCI (UART) Interfaces 2 (asynchronous) —
GPIO / Digital I/O Lines 20 discrete digital I/O lines —
Temperature Grade Industrial —
安装类型 Surface Mount Surface Mount
RoHS 状态 Compliant (verify per lot) Compliant
Debug Interface Single-wire BDM (Background Debug Mode) —
MSL 等级 [DATA_NEEDED: MSL Level] 3 (168 hours, JEDEC J-STD-020)
Lead-Free Yes —
Maximum CPU/Bus Frequency — 25 MHz
RAM Size — 12 KB
EEPROM Size — 4 KB
Number of I/O Lines — 91
Supply Voltage Range — 2.97 V to 5.5 V (single 5 V supply)
工作温度范围 — -40 °C to +85 °C (industrial)
封装 / 外壳 — 112-LQFP (20 x 20 mm)
Communication Interfaces — 2 x SCI, 2 x SPI, I2C, CAN 2.0
Timers — Enhanced Capture Timer (ECT) + watchdog
On-chip Debug — Background Debug Mode (BDM)

数据手册与资源

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