MCF52277CVM160J vs SCF5250VM120 Comparación
Comparación detallada lado a lado de MCF52277CVM160J por NXP Semiconductors y SCF5250VM120 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MCF52277CVM160J | SCF5250VM120 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Unknown |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $14,85 | $0,00 |
| Core Architecture | ColdFire V2 (32-bit RISC) | — |
| Frecuencia de reloj máxima | 166.67 MHz | — |
| Program Memory | ROMless (external memory required) | ROMless |
| Internal SRAM | 128 KB | — |
| Instruction/Data Cache | 8 KB configurable | — |
| LCD Controller | Integrated (supports TFT up to SVGA) | — |
| Touchscreen Controller | Integrated 4-wire resistive | — |
| Ethernet MAC | 10/100 Mbps with on-chip PHY | — |
| USB Interface | USB 2.0 Full-Speed On-The-Go | — |
| CAN Interface | FlexCAN | — |
| UART Channels | 3 | — |
| I2C Channels | 2 | — |
| SPI Channels | 2 | — |
| External Bus Interface | Yes (32-bit) | — |
| Debug Interface | BDM + JTAG | — |
| Encapsulado | 196-ball MAP-BGA (15 x 15 mm) | 196-LBGA (15 x 15 mm) |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Supply Voltage (Core) | 1.5 V nominal | — |
| Supply Voltage (I/O) | 3.3 V nominal | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Architecture | — | RISC 32-bit |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Number of I/O Pins | — | 57 |
| Tensión de alimentación | — | 3.3 V |
| Process Technology | — | 0.13 um |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |