MCF52277CVM160J vs SCF5250VM120 Vergleich

Detaillierter Direktvergleich von MCF52277CVM160J von NXP Semiconductors und SCF5250VM120 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MCF52277CVM160J MCF52277CVM160J - ColdFire V2 32-bit MPU 166MHz | NXP

MCF52277CVM160J - ColdFire V2 32-bit MPU 166MHz | NXP

MCF52277CVM160J ✓ Aktiv
NXP Semiconductors
SCF5250VM120 SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

SCF5250VM120 - 120MHz ColdFire Microcontroller | NXP

SCF5250VM120 Unknown

Spezifikationsvergleich

Parameter MCF52277CVM160J SCF5250VM120
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Unknown
Lagerstatus In Stock In Stock
Stückpreis (USD) $14,85 $0,00
Core Architecture ColdFire V2 (32-bit RISC) —
Maximale Taktfrequenz 166.67 MHz —
Program Memory ROMless (external memory required) ROMless
Internal SRAM 128 KB —
Instruction/Data Cache 8 KB configurable —
LCD Controller Integrated (supports TFT up to SVGA) —
Touchscreen Controller Integrated 4-wire resistive —
Ethernet MAC 10/100 Mbps with on-chip PHY —
USB Interface USB 2.0 Full-Speed On-The-Go —
CAN Interface FlexCAN —
UART Channels 3 —
I2C Channels 2 —
SPI Channels 2 —
External Bus Interface Yes (32-bit) —
Debug Interface BDM + JTAG —
Gehäuse 196-ball MAP-BGA (15 x 15 mm) 196-LBGA (15 x 15 mm)
Montageart Surface Mount —
Betriebstemperatur -40C to +85C (industrial) [DATA_NEEDED: operating temperature range]
RoHS-Status Compliant [DATA_NEEDED: RoHS compliance]
Supply Voltage (Core) 1.5 V nominal —
Supply Voltage (I/O) 3.3 V nominal —
Product Type — 32-bit ROMless microcontroller
Processor Core — ColdFire V2 MCF52xx
Architecture — RISC 32-bit
Maximum Processor Frequency — 120 MHz
RAM Size — 128 kB
Number of I/O Pins — 57
Versorgungsspannung — 3.3 V
Process Technology — 0.13 um
Package Type — MAP-BGA-196
Tray Packaging — Tray
Manufacturer — NXP Semiconductors
Datasheet File Size — 1 MB
Datasheet Page Count — 56 pages
REACH Status — [DATA_NEEDED: REACH compliance]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification]

Datenblätter & Ressourcen

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