MCF52277CVM160J vs SCF5250VM120 Comparaison
Comparaison détaillée côte à côte de MCF52277CVM160J par NXP Semiconductors et SCF5250VM120 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MCF52277CVM160J | SCF5250VM120 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Unknown |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $14,85 | $0,00 |
| Core Architecture | ColdFire V2 (32-bit RISC) | — |
| Fréquence d'horloge maximale | 166.67 MHz | — |
| Program Memory | ROMless (external memory required) | ROMless |
| Internal SRAM | 128 KB | — |
| Instruction/Data Cache | 8 KB configurable | — |
| LCD Controller | Integrated (supports TFT up to SVGA) | — |
| Touchscreen Controller | Integrated 4-wire resistive | — |
| Ethernet MAC | 10/100 Mbps with on-chip PHY | — |
| USB Interface | USB 2.0 Full-Speed On-The-Go | — |
| CAN Interface | FlexCAN | — |
| UART Channels | 3 | — |
| I2C Channels | 2 | — |
| SPI Channels | 2 | — |
| External Bus Interface | Yes (32-bit) | — |
| Debug Interface | BDM + JTAG | — |
| Boîtier | 196-ball MAP-BGA (15 x 15 mm) | 196-LBGA (15 x 15 mm) |
| Type de montage | Surface Mount | — |
| Température de fonctionnement | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS compliance] |
| Supply Voltage (Core) | 1.5 V nominal | — |
| Supply Voltage (I/O) | 3.3 V nominal | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Architecture | — | RISC 32-bit |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Number of I/O Pins | — | 57 |
| Tension d'alimentation | — | 3.3 V |
| Process Technology | — | 0.13 um |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |