MPC555LFMZP40 vs SPC5642AF2MVZ3 Comparación

Comparación detallada lado a lado de MPC555LFMZP40 por NXP Semiconductors y SPC5642AF2MVZ3 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPC555LFMZP40 MPC555LFMZP40 - 32-Bit 40MHz 448KB Flash MCU | NXP

MPC555LFMZP40 - 32-Bit 40MHz 448KB Flash MCU | NXP

MPC555LFMZP40 ✗ Fin de vida
NXP Semiconductors
SPC5642AF2MVZ3 SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 32-Bit 80MHz Automotive MCU | NXP

SPC5642AF2MVZ3 ✓ Activo

Comparación de especificaciones

Parámetro MPC555LFMZP40 SPC5642AF2MVZ3
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Fin de vida Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $0,00 $0,00
Product Type 32-bit microcontroller —
Processor Architecture PowerPC —
Operating Frequency 40 MHz —
Program Memory Size 448 KB (448K x 8) —
RAM Size 26 KB (26K x 8) —
Number of I/O 101 —
Encapsulado 272-PBGA (27x27 mm) —
Tipo de montaje Surface mount Surface Mount
Oscillator Type External —
Packaging Tray —
Core PowerPC —
Microcontroller Family MPC5xx —
Series Qorivva —
Bit Width 32-bit —
Program Memory Organization 448K x 8 —
RAM Organization 26K x 8 —
Device Class Embedded microcontroller —
Operating Voltage [DATA_NEEDED: operating voltage] —
Temperatura de funcionamiento [DATA_NEEDED: operating temperature] —
Estado RoHS [DATA_NEEDED: RoHS status] —
REACH Status [DATA_NEEDED: REACH status] —
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] —
Device Type — 32-bit automotive microcontroller
Processor Core — Power Architecture core
Architecture — 32-bit
Maximum Operating Frequency — 80 MHz
Flash Memory — 2 MB
Flash Organization — 2M x 8 bits
Family — MPC56xx Qorivva
Rango de temperatura de funcionamiento — -40°C to +105°C
Temperature Grade — Automotive Grade
Package Type — PBGA-324
Package Body Size — 23 mm x 23 mm
Terminal Form — Ball
Intended Applications — Powertrain, chassis, engine control, transmission control, and industrial applications
Tensión de alimentación — [DATA_NEEDED: Supply Voltage]
RAM Memory — [DATA_NEEDED: RAM Memory]
Number of I/O Pins — [DATA_NEEDED: Number of I/O Pins]
Security and Diagnostics Features — [DATA_NEEDED: Security and Diagnostics Features]

Hojas de datos y recursos

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