MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
N.º de pieza: MPC8245LVV333D ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.1 | $721,00 |
| 100 | $64.85 | $6.485,00 |
| 500 | $58.2 | $29.100,00 |
| 1.000 | $52.75 | $52.750,00 |
MPC8245LVV333D Descripción general
An Integrated Host Processor (IHP) is a category of system-on-chip (SoC) that merges a microprocessor core with chipset-style glue logic - in this case the MPC603e core plus an MPC107-style peripheral bridge - to reduce bill-of-materials cost, board area, and power consumption versus a discrete CPU-plus-chipset solution. It sits within the broader hierarchy: 32-bit embedded microprocessor -> PowerPC architecture -> Power Architecture technology -> integrated host processor -> embedded SoC, and it is typically deployed in cost- and space-constrained embedded systems where PCI connectivity and DRAM control are required without a full north-bridge design.
Key differentiating features include the 333 MHz 603e core with on-chip L1 cache, a 64-bit SDRAM memory controller that supports PC133 SDRAM, a 32-bit PCI 2.2-compliant interface running up to 66 MHz, two universal serial ports, I2C, and a programmable interrupt controller. The device operates from a 2.0 V core / 3.3 V I/O supply and is qualified over the 0 to +105 C junction temperature range for embedded industrial and networking applications.
The MPC8245LVV333D uses a Power Architecture superscalar core capable of dual-issue out-of-order execution, while the integrated peripheral block uses a 64-bit internal bus to the core to sustain peripheral throughput. The memory controller supports byte-write-enabled SDRAM with error-correction features, and the PCI block supports both host and agent modes. Together these blocks allow a single chip to replace a discrete CPU, north bridge, and memory controller in legacy PCI-based embedded designs.
Typical applications include PCI-based embedded controllers, network-attached storage (NAS) appliances, industrial printers and imaging systems, telecom line cards, and other cost-sensitive PCI/SDRAM embedded platforms. According to the verified product listings on DigiKey, the part is offered by NXP USA Inc. and is currently distributed for the Freescale legacy part number.
When designing with this part, ensure the 2.0 V core and 3.3 V I/O supplies are decoupled per the manufacturer reference board and that the 352-ball TBGA land pattern follows the JEDEC MO-143 footprint for reliable assembly. The 'L' suffix indicates the 2.0 V low-voltage core variant; the 'V' suffix indicates the 35x35 TBGA, and the trailing 'D' indicates the die revision.
This page synthesizes distributor inventory from DigiKey and Mouser, same-package drop-in MPC8245 speed- and package-grade alternatives, and design notes drawn from the manufacturer hardware specification document - information not consolidated in the datasheet PDF alone.
Alternativas directas para MPC8245LVV333D — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8245LVV333D (mismo factor de forma y huella) — difiere en Operating Temperature, Manufacturer, Memory Controller, RoHS Status, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8245LZU333D
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8245TZU333D
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8245LVV350D
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$110.75 / unidad
Ver hoja de datos →MPC8245LVV300D
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$79.4 / unidad
Ver hoja de datos →MPC8245LVV266D
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$48.9 / unidad
Ver hoja de datos →MPC8245LVV333D Valores máximos y características eléctricas
| Manufacturer | NXP USA Inc. (formerly Freescale / Motorola) |
| Product Category | Microprocessors (MPU) |
| Core Architecture | PowerPC 603e (Power Architecture technology) |
| Core Count | 1 |
| Ancho del bus de datos | 32-bit |
| Core Frequency | 333 MHz |
| Integrated Bridge | PCI bridge + memory controller |
| PCI Interface | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Memory Controller | 64-bit SDRAM (PC133), ROM/Flash interface |
| Supply Voltage - Core | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | 3.3 V |
| Temperatura de funcionamiento | 0 C to +105 C (junction) |
| Encapsulado / Carcasa | 352-TBGA (35x35 mm) |
| Tipo de montaje | Surface Mount (BGA) |
Guía de configuración de pines de MPC8245LVV333D 352-tbga (35x35 mm)
Configuración de pines para MPC8245LVV333D (encapsulado 352-tbga (35x35 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8245LVV333D.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8245LVV333D es adecuado para 6 aplicacións: PCI-Based Embedded Controllers, Network-Attached Storage (NAS) Appliances, Industrial Printers and Imaging Systems, Telecom Line Cards and Access Equipment, Medical Imaging and Diagnostic Equipment, Embedded Single-Board Computers (SBCs).
PCI-Based Embedded Controllers
The MPC8245LVV333D's integrated PCI 2.2 bridge and 333 MHz 603e core make it well-suited for PCI-based embedded controllers in industrial machinery. The 32-bit PCI interface running up to 66 MHz allows direct connection to PCI peripherals such as data-acquisition cards, motion controllers, and custom ASICs without an external north bridge. With 64-bit SDRAM support up to PC133 and on-chip ROM/Flash interface, the processor can host both the application code and real-time OS in a single chip. Designers can pair it with the legacy PowerPC toolchain and VxWorks or Linux 2.6 kernels still common in long-lifecycle industrial platforms.
Recomendado
Network-Attached Storage (NAS) Appliances
Embedded NAS appliances in the mid-2000s frequently used the MPC8245 family because the integrated PCI bridge and 64-bit SDRAM controller simplify the storage and networking data path. The 333 MHz core in the MPC8245LVV333D provides sufficient throughput for CIFS/NFS file-serving workloads at multi-megabyte rates, and the integrated peripherals reduce BOM cost in price-sensitive SOHO NAS designs. The 352-TBGA package and 2.0 V low-voltage core help meet small-form-factor and fanless thermal envelopes typical of NAS enclosures. Recommended companion chips include PCI Gigabit Ethernet controllers and PCI SATA controllers that ride directly on the integrated PCI bus.
Recomendado
Industrial Printers and Imaging Systems
High-speed industrial printers and imaging systems leverage the MPC8245LVV333D's combination of 333 MHz 603e processing power, integrated PCI bridge, and SDRAM controller to drive print engines and image-processing pipelines. The 64-bit memory bus bandwidth supports real-time raster image processing at print speeds, while the PCI bus connects to scanner modules and network interfaces. The 0 to +105 C operating temperature range suits the elevated ambient temperatures inside printer enclosures. Its long product lifecycle historically made the MPC8245 family a popular choice for OEMs supporting printers in service for 10+ years.
Recomendado
Telecom Line Cards and Access Equipment
Legacy telecom line cards and access multiplexers relied on the MPC8245LVV333D's PCI bridge and PowerPC processing for packet handling and control-plane tasks. The integrated peripherals (PCI, SDRAM, I2C, two serial ports) match telecom slot-card requirements where each line card needs a local processor with deterministic PCI connectivity to a backplane. The 333 MHz 603e core runs control-plane stacks with sufficient headroom for signaling protocols. Although modern designs use QorIQ or Layerscape SoCs, many deployed line cards still operate on MPC8245 silicon and require continued supply for repair operations.
Recomendado
Medical Imaging and Diagnostic Equipment
Long-lifecycle medical imaging systems historically use the MPC8245LVV333D as an embedded controller for image acquisition and processing sub-systems, where the integrated PCI bus connects to ultrasound or MRI front-end digitizers and the 333 MHz core performs pre-processing. The 64-bit SDRAM controller handles the high-bandwidth image-data buffers required by diagnostic scans, while the 2.0 V core keeps thermal dissipation within the sealed medical-device enclosures. Field-serviceability for medical equipment installed 10-15 years ago continues to drive legacy demand for this exact 333 MHz speed grade in the 352-TBGA package.
Recomendado
Embedded Single-Board Computers (SBCs)
The MPC8245LVV333D serves as the main processor on legacy PCI-based single-board computers used in transportation, military, and aerospace subsystems where board longevity outpaces silicon availability. Its integrated bridge eliminates the need for a separate north bridge, simplifying SBC layouts and improving shock/vibration reliability by reducing component count. The 352-TBGA package is well suited to conduction-cooled chassis. For new SBC designs NXP recommends the QorIQ LS1 family, but for maintaining the installed base of MPC8245-based SBCs, the LZU333D and ZU333D variants are drop-in compatible replacements when supply of the LVV333D runs short.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8245LVV333D — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8245LZU333D | MPC8245TZU333D | MPC8245LVV350D | MPC8245LVV300D | MPC8245LVV266D |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35 mm) | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same |
| Core Frequency | 333 MHz | 333 MHz | 333 MHz | 350 MHz (+5%) | 300 MHz (-10%) | 266 MHz (-20%) |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Core Voltage | 2.0 V | 2.0 V | 2.0 V | 2.0 V | 2.0 V | 2.0 V |
| PCI Interface | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz | PCI 2.2, 32-bit, 66 MHz |
| Memory Controller | 64-bit PC133 SDRAM | 64-bit PC133 SDRAM | 64-bit PC133 SDRAM | 64-bit PC133 SDRAM | 64-bit PC133 SDRAM | 64-bit PC133 SDRAM |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C | 0 C to +105 C |
Diferenciadores clave
- Lowest core voltage in the MPC8245 family at 333 MHz (frente a MPC8245LVV333D vs higher-voltage MPC8245 variants)
- Drop-in compatibility with the entire MPC8245 352-TBGA family (frente a MPC8245LVV333D vs PowerQUICC II MPC8275)
- Integrated PCI 2.2 bridge with host and agent modes (frente a MPC8245LVV333D vs PowerPC 603e + external north bridge)
Notas de diseño
The MPC8245LVV333D requires two independent supply rails - 2.0 V for the 603e core (L-suffix variant) and 3.3 V for I/O. Use a low-dropout regulator with at least 2 A peak current capability on the 2.0 V rail and bulk-decoupling capacitors placed within 1 cm of the BGA balls. Power-rail sequencing per the manufacturer reference board should bring the 2.0 V core rail up before or simultaneously with the 3.3 V I/O rail to avoid latch-up. Add 10 uF bulk plus 100 nF high-frequency ceramic decoupling on each rail to suppress switching noise from the integrated PCI bridge.
Estimated: at 333 MHz core frequency and 2.0 V core, the 603e core in the MPC8245LVV333D typically dissipates 1.5-2.0 W. The 352-TBGA package has a junction-to-ambient thermal resistance of approximately 15-18 C/W with a 4-layer PCB and adequate copper pour, so the resulting junction temperature rise is about 25-36 C above ambient. With a 0 to +105 C junction spec, this leaves 65-80 C of ambient headroom, sufficient for sealed embedded enclosures without active cooling. For higher ambient environments (above 70 C), add a heat spreader or small heatsink on the top of the BGA.
The 352-TBGA (35x35 mm) land pattern must follow the JEDEC MS-034 style BGA footprint with 1.27 mm ball pitch. Use 0.5 mm-diameter NSMD pads with a 0.6 mm solder mask opening for reliable assembly. Match the inner BGA balls (which carry the SDRAM data bus) to a 50 ohm controlled-impedance trace going to the SDRAM, and route the 64-bit data bus with matched trace lengths within +/- 0.5 mm to preserve signal integrity at PC133 SDRAM rates. Escape the inner rows of the BGA using via-in-pad or micro-via technology on at least 4 PCB layers.
Common pitfalls include: (1) confusing the 'L' suffix 2.0 V variant with the original 2.5 V variant - both exist in the MPC8245 family, so verify the voltage on your schematic before board bring-up; (2) failing to configure the PCI bridge mode (host vs agent) correctly - in agent mode the device will not enumerate the PCI bus; (3) overlooking that the MPC8245LVV333D uses a different JTAG chain than the PowerQUICC family, requiring legacy MPC8xxx JTAG tools rather than QorIQ tools. Also note that this part is obsolete and should not be selected for new designs.
Información de cumplimiento
RoHS / REACH / lead-free status was not explicitly confirmed in the verified web data. The part is now obsolete and supplied only through remaining stock and authorized continuing-supply partners. Request a RoHS/lead-free certificate from Rochester Electronics or DigiKey before placing the order for any EU-bound product.