MPC8245LVV350D vs MPC8245LVV333D Comparación
Comparación detallada lado a lado de MPC8245LVV350D por NXP Semiconductors y MPC8245LVV333D por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8245LVV333D - 333MHz PowerPC 603e Integrated Host Processor
MPC8245LVV333D ObsoleteComparación de especificaciones
| Parámetro | MPC8245LVV350D | MPC8245LVV333D |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $110,75 | $52,75 |
| Manufacturer | NXP USA Inc. | NXP USA Inc. (formerly Freescale / Motorola) |
| Series | MPC82xx | — |
| Core Processor | PowerPC 603e | — |
| Number of Cores | 1 | — |
| Bus Width | 32-Bit | — |
| Clock Speed | 350 MHz | — |
| Temperatura de funcionamiento | 0 to 105 C | 0 C to +105 C (junction) |
| Tensión de alimentación | 3.3 V | — |
| Process Technology | 0.25 um CMOS | — |
| RAM Controller | SDRAM | — |
| Graphics Acceleration | No | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet controller] | — |
| Display & Interface | PCI bridge | — |
| Encapsulado | 352-TBGA (35 x 35 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | See manufacturer datasheet | [DATA_NEEDED: rohs status not confirmed in verified web data] |
| Product Category | — | Microprocessors (MPU) |
| Core Architecture | — | PowerPC 603e (Power Architecture technology) |
| Core Count | — | 1 |
| Ancho del bus de datos | — | 32-bit |
| Core Frequency | — | 333 MHz |
| Integrated Bridge | — | PCI bridge + memory controller |
| PCI Interface | — | PCI 2.2 compliant, 32-bit, up to 66 MHz |
| Memory Controller | — | 64-bit SDRAM (PC133), ROM/Flash interface |
| Supply Voltage - Core | — | 2.0 V (L suffix, low-voltage core) |
| Supply Voltage - I/O | — | 3.3 V |
| Encapsulado / Carcasa | — | 352-TBGA (35x35 mm) |
| Lead-Free / BGA Solder | — | [DATA_NEEDED: lead-free status not confirmed] |