MPC8250AVVMHBC vs MPC8250ACZUMHBC Comparación
Comparación detallada lado a lado de MPC8250AVVMHBC por NXP Semiconductors y MPC8250ACZUMHBC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8250AVVMHBC - 266MHz PowerQUICC II MPU, 480-TBGA | NXP
MPC8250AVVMHBC ⚠ Última compraNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8250AVVMHBC | MPC8250ACZUMHBC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $75,76 | $85,00 |
| Processor Type | MPC82xx PowerQUICC II | — |
| Core | PowerPC G2 | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Ancho del bus de datos | 32-bit | 32-bit internal / 64-bit external |
| Core Frequency | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| Graphics Acceleration | No | No |
| RAM Controllers | DRAM, SDRAM | DRAM, SDRAM |
| Core Voltage | 2.0 V | 1.8 V |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Free Status | Lead Free | — |
| Process Technology | 0.25 um CMOS (per family) | 0.25 micron |
| Family | MPC82xx / PowerQUICC II | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | — | MPC82xx (PowerQUICC II) |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Encapsulado / Carcasa | — | 480-TBGA (37.5 x 37.5 mm) |
| Recuento de pines | — | 480 |
| Architecture | — | RISC |
| Estado del ciclo de vida | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |