MPC8250AVVMHBC vs MPC8250ACZUMHBC Comparaison
Comparaison détaillée côte à côte de MPC8250AVVMHBC par NXP Semiconductors et MPC8250ACZUMHBC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8250AVVMHBC - 266MHz PowerQUICC II MPU, 480-TBGA | NXP
MPC8250AVVMHBC ⚠ Dernier achatNXP Semiconductors
MPC8250ACZUMHBC - PowerPC G2 MPU 266MHz 480-TBGA | NXP
MPC8250ACZUMHBC ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC8250AVVMHBC | MPC8250ACZUMHBC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $75,76 | $85,00 |
| Processor Type | MPC82xx PowerQUICC II | — |
| Core | PowerPC G2 | — |
| Number of Cores | 1 | 1 Core, 32-Bit |
| Largeur du bus de données | 32-bit | 32-bit internal / 64-bit external |
| Core Frequency | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| Graphics Acceleration | No | No |
| RAM Controllers | DRAM, SDRAM | DRAM, SDRAM |
| Core Voltage | 2.0 V | 1.8 V |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Boîtier | 480-TBGA (37.5 x 37.5 mm) | — |
| Type de montage | Surface Mount | Surface Mount (BGA) |
| Statut RoHS | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Free Status | Lead Free | — |
| Process Technology | 0.25 um CMOS (per family) | 0.25 micron |
| Family | MPC82xx / PowerQUICC II | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale/Motorola) |
| Series | — | MPC82xx (PowerQUICC II) |
| Core Processor | — | PowerPC G2 |
| Co-Processors / DSP | — | Communications; RISC CPM |
| Speed | — | 266 MHz |
| Supply Voltage (I/O) | — | 3.3 V |
| Boîtier / Format | — | 480-TBGA (37.5 x 37.5 mm) |
| Nombre de broches | — | 480 |
| Architecture | — | RISC |
| Statut du cycle de vie | — | Last Time Buy (NXP EOL announced) |
| Lead Free | — | Yes (per BGA-516 datasheet note: LEAD FREE, PLASTIC) |