MPC8255ACVVMHBB vs MPC8255AVVMHBB Comparación
Comparación detallada lado a lado de MPC8255ACVVMHBB por NXP Semiconductors y MPC8255AVVMHBB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ Activo
Comparación de especificaciones
| Parámetro | MPC8255ACVVMHBB | MPC8255AVVMHBB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | PowerPC G2, 32-bit |
| Number of Cores | 1 | 1 |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Estado RoHS | Compliant | Non-compliant (NO-PB suffix - lead-bearing) |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Bus Frequency | — | 133 MHz (core-to-memory bus) |
| Cache (I/D) | — | 16 Kbyte instruction / 16 Kbyte data |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Integrated Ethernet MAC | — | 2x 10/100 Mbit/s (MII/RMII) |
| PCI Interface | — | Yes (32-bit, 66 MHz capable) |
| CPM Serial Controllers | — | HDLC/SDLC, UART, I2C, SPI, SCC/SMC |
| Temperatura de funcionamiento | — | -40C to +105C (extended, per 'MH' suffix) |
| Process Technology | — | 0.18 micrometre CMOS |
| Tipo de montaje | — | Surface Mount (BGA) |
| Lifecycle | — | No Longer Manufactured (NXP) |