MPC8255ACVVMHBB vs MPC8255AVVMHBB Comparação

Comparação detalhada lado a lado de MPC8255ACVVMHBB por NXP Semiconductors e MPC8255AVVMHBB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8255ACVVMHBB MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP

MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP

MPC8255ACVVMHBB ✓ Ativo
NXP Semiconductors
MPC8255AVVMHBB MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB Obsolete

Comparação de especificações

Parâmetro MPC8255ACVVMHBB MPC8255AVVMHBB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Part Family PowerQUICC II MPC82xx —
Core Architecture PowerPC G2 (32-bit) PowerPC G2, 32-bit
Number of Cores 1 1
Operating Frequency 266 MHz —
Core Voltage 2 V —
I/O Voltage 3.3 V —
Encapsulamento 480-TBGA (37.5 x 37.5 mm) 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch)
Ball Pitch 1.0 mm (typical for 480-TBGA) —
Packaging Tray —
Temperature Grade Industrial —
Lead Free Yes —
Status RoHS Compliant Non-compliant (NO-PB suffix - lead-bearing)
Communications Processor Module (CPM) Integrated RISC-based CPM with FCC/MCC/SCC —
System Bus 64-bit 60x bus —
JTAG / COP Debug Yes —
Series — PowerQUICC II (MPC82xx)
Core Frequency — 266 MHz
Bus Frequency — 133 MHz (core-to-memory bus)
Cache (I/D) — 16 Kbyte instruction / 16 Kbyte data
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V
Integrated Ethernet MAC — 2x 10/100 Mbit/s (MII/RMII)
PCI Interface — Yes (32-bit, 66 MHz capable)
CPM Serial Controllers — HDLC/SDLC, UART, I2C, SPI, SCC/SMC
Temperatura de operação — -40C to +105C (extended, per 'MH' suffix)
Process Technology — 0.18 micrometre CMOS
Tipo de montagem — Surface Mount (BGA)
Lifecycle — No Longer Manufactured (NXP)

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