MPC8255ACVVMHBB vs MPC8255AVVMHBB Comparaison
Comparaison détaillée côte à côte de MPC8255ACVVMHBB par NXP Semiconductors et MPC8255AVVMHBB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPC8255ACVVMHBB ✓ Actif
Comparaison des spécifications
| Paramètre | MPC8255ACVVMHBB | MPC8255AVVMHBB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Family | PowerQUICC II MPC82xx | — |
| Core Architecture | PowerPC G2 (32-bit) | PowerPC G2, 32-bit |
| Number of Cores | 1 | 1 |
| Operating Frequency | 266 MHz | — |
| Core Voltage | 2 V | — |
| I/O Voltage | 3.3 V | — |
| Boîtier | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) | — |
| Packaging | Tray | — |
| Temperature Grade | Industrial | — |
| Lead Free | Yes | — |
| Statut RoHS | Compliant | Non-compliant (NO-PB suffix - lead-bearing) |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC | — |
| System Bus | 64-bit 60x bus | — |
| JTAG / COP Debug | Yes | — |
| Series | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Bus Frequency | — | 133 MHz (core-to-memory bus) |
| Cache (I/D) | — | 16 Kbyte instruction / 16 Kbyte data |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Integrated Ethernet MAC | — | 2x 10/100 Mbit/s (MII/RMII) |
| PCI Interface | — | Yes (32-bit, 66 MHz capable) |
| CPM Serial Controllers | — | HDLC/SDLC, UART, I2C, SPI, SCC/SMC |
| Température de fonctionnement | — | -40C to +105C (extended, per 'MH' suffix) |
| Process Technology | — | 0.18 micrometre CMOS |
| Type de montage | — | Surface Mount (BGA) |
| Lifecycle | — | No Longer Manufactured (NXP) |