MPC8260ACZUMIBB vs MPC8255ACZUMHBB Comparación
Comparación detallada lado a lado de MPC8260ACZUMIBB por NXP Semiconductors y MPC8255ACZUMHBB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteComparación de especificaciones
| Parámetro | MPC8260ACZUMIBB | MPC8255ACZUMHBB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $200,00 | $97,50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | 0.25 micron (HiP4) silicon revision |
| Encapsulado | 480-TBGA (37.5 x 37.5 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: full operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II HIP4 |
| Core Architecture | — | PowerPC G2 |
| Ancho del bus de datos | — | 64-Bit |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |
| Estado RoHS | — | [DATA_NEEDED: RoHS compliance status] |