MPC8260ACZUMIBB vs MPC8255ACZUMHBB Comparaison
Comparaison détaillée côte à côte de MPC8260ACZUMIBB par NXP Semiconductors et MPC8255ACZUMHBB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteComparaison des spécifications
| Paramètre | MPC8260ACZUMIBB | MPC8255ACZUMHBB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $200,00 | $97,50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | 0.25 micron (HiP4) silicon revision |
| Boîtier | 480-TBGA (37.5 x 37.5 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: full operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II HIP4 |
| Core Architecture | — | PowerPC G2 |
| Largeur du bus de données | — | 64-Bit |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |
| Statut RoHS | — | [DATA_NEEDED: RoHS compliance status] |