MPC8260ACZUMIBB vs MPC8255ACZUMHBB Comparação
Comparação detalhada lado a lado de MPC8260ACZUMIBB por NXP Semiconductors e MPC8255ACZUMHBB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MPC8260ACZUMIBB - PowerQUICC II MPU 266MHz 480-TBGA | NXP
MPC8260ACZUMIBB ObsoleteNXP Semiconductors
MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP
MPC8255ACZUMHBB ObsoleteComparação de especificações
| Parâmetro | MPC8260ACZUMIBB | MPC8255ACZUMHBB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Obsolete | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $200,00 | $97,50 |
| Core Processor | PowerPC G2 | — |
| Architecture | RISC 32-bit | — |
| Number of Cores | 1 | 1 |
| Core Clock Speed | 266 MHz | — |
| Co-Processor / DSP | Communications; RISC CPM | — |
| RAM Controllers | DRAM, SDRAM | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None (per datasheet) | — |
| Supply Voltage - Core | 1.8 V | — |
| Supply Voltage - I/O | 3.3 V | — |
| Process Technology | 0.25 µm CMOS | 0.25 micron (HiP4) silicon revision |
| Encapsulamento | 480-TBGA (37.5 x 37.5 mm) | — |
| Tipo de montagem | Surface Mount | Surface Mount |
| Temperatura de operação | [DATA_NEEDED: full operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Part Status | Not For New Designs (No Longer Manufactured) | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | PowerQUICC II HIP4 |
| Core Architecture | — | PowerPC G2 |
| Largura do barramento de dados | — | 64-Bit |
| Core Supply Voltage | — | 1.8 V |
| Maximum Clock Speed | — | 266 MHz |
| Instruction Set | — | 32-Bit RISC |
| Core | — | MPC82xx |
| Package Type | — | T-BGA |
| Pin/Ball Count | — | 480 |
| Package Size | — | 37.50 x 37.50 mm |
| Package Height | — | 1.55 mm |
| Ball Pitch | — | 1.27 mm |
| Integrated CPM | — | Yes (dual communications processor modules) |
| Ethernet MACs | — | Dual 10/100 MAC |
| Status RoHS | — | [DATA_NEEDED: RoHS compliance status] |