MPC8270CVRMIBA vs MPC8270VRMIBA Comparación
Comparación detallada lado a lado de MPC8270CVRMIBA por NXP Semiconductors y MPC8270VRMIBA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Fin de vidaNXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8270CVRMIBA | MPC8270VRMIBA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $88,75 | $95,75 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | — |
| Ancho del bus de datos | 64-Bit | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | 3.3 V |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) |
| Temperatura de funcionamiento | -40 C to +105 C | 0 C to 105 C |
| Tipo de montaje | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | PCI, USB, HDLC, 10/100 Ethernet |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Estado RoHS | Lead-Free / Compliant (per package marking) | [DATA_NEEDED: RoHS status] |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Core Architecture | — | PowerPC G2_LE, 32-bit |
| Core Frequency | — | 266 MHz |
| Number of Cores | — | 1 |
| On-Chip Cache | — | 32 KB |
| Core Voltage | — | 1.45 V to 1.6 V |
| Process Technology | — | HiPerMOS7, 0.13 micron |
| Encapsulado | — | 516-PBGA (27 x 27 mm) |
| Communications Module | — | CPM with multi-channel HDLC and ATM |
| PCI Interface | — | PCI 2.2 compliant |
| USB Interface | — | USB 1.1 (function or host with external PHY) |
| Ethernet MACs | — | Up to 3 x 10/100 Ethernet |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |