MPC8270CVRMIBA vs MPC8270VRMIBA Comparaison
Comparaison détaillée côte à côte de MPC8270CVRMIBA par NXP Semiconductors et MPC8270VRMIBA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Fin de vieNXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC8270CVRMIBA | MPC8270VRMIBA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $88,75 | $95,75 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | — |
| Largeur du bus de données | 64-Bit | — |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | 3.3 V |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | — |
| Series | PowerQUICC II (MPC82xx) | PowerQUICC II (MPC82xx) |
| Température de fonctionnement | -40 C to +105 C | 0 C to 105 C |
| Type de montage | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | PCI, USB, HDLC, 10/100 Ethernet |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Niveau MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL level] |
| Statut RoHS | Lead-Free / Compliant (per package marking) | [DATA_NEEDED: RoHS status] |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Core Architecture | — | PowerPC G2_LE, 32-bit |
| Core Frequency | — | 266 MHz |
| Number of Cores | — | 1 |
| On-Chip Cache | — | 32 KB |
| Core Voltage | — | 1.45 V to 1.6 V |
| Process Technology | — | HiPerMOS7, 0.13 micron |
| Boîtier | — | 516-PBGA (27 x 27 mm) |
| Communications Module | — | CPM with multi-channel HDLC and ATM |
| PCI Interface | — | PCI 2.2 compliant |
| USB Interface | — | USB 1.1 (function or host with external PHY) |
| Ethernet MACs | — | Up to 3 x 10/100 Ethernet |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |