MPC8313EVRAFFB vs MPC8313EVRAGDB Comparación
Comparación detallada lado a lado de MPC8313EVRAFFB por NXP Semiconductors y MPC8313EVRAGDB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP
MPC8313EVRAFFB ✓ ActivoNXP Semiconductors
MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors
MPC8313EVRAGDB ObsoleteComparación de especificaciones
| Parámetro | MPC8313EVRAFFB | MPC8313EVRAGDB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $42,85 | $17,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Status | Active | — |
| Core Architecture | PowerPC e300c3 | 32-bit RISC |
| Processor Series | MPC83xx (PowerQUICC II Pro) | MPC83xx (PowerQUICC II Pro) |
| Core Count | 1 | — |
| Ancho del bus de datos | 32-bit | 32 bit |
| Maximum CPU Frequency | 333 MHz | — |
| Package Type | 516-TEPBGA (27 mm x 27 mm) with exposed die pad | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Encryption Engine | Yes (AES, DES, 3DES, IPsec) | — |
| Ethernet Controllers | [DATA_NEEDED: ethernet port count and speed] | — |
| Memory Controller | DDR1/DDR2 (up to 256 MB addressable) | DDR1/DDR2 SDRAM |
| PCI Express | [DATA_NEEDED: PCIe lane count] | 2 x PCIe interfaces |
| USB Interface | [DATA_NEEDED: USB revision] | USB 2.0 Host/Device |
| RoHS | Details per manufacturer (status not confirmed by web data snippet) | — |
| Supplier Device Package | 516-TEPBGA | — |
| Core | — | PowerPC e300c3 |
| Maximum CPU Clock | — | 400 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 0.09 um CMOS |
| Supply Voltage - I/O | — | 1.8V / 2.5V / 3.3V |
| Encapsulado | — | 516-TEPBGA (27x27 mm) with Exposed Pad |
| Number of Pins/Balls | — | 516 balls |
| Temperatura de funcionamiento | — | -40C to +85C (Industrial) |
| Integrated Ethernet MACs | — | 2 (10/100/1000 Mbps eTSECs) |
| Cryptography Engine | — | Hardware IPsec, AES, DES/3DES, Kasumi |
| Security Enabled | — | Yes (E suffix) |
| Estado RoHS | — | non-compliant per legacy Freescale datasheet |
| Pin/Ball Count | — | 516 |