MPC8313EVRAFFB vs MPC8313EVRAGDB Comparaison
Comparaison détaillée côte à côte de MPC8313EVRAFFB par NXP Semiconductors et MPC8313EVRAGDB par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP
MPC8313EVRAFFB ✓ ActifNXP Semiconductors
MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors
MPC8313EVRAGDB ObsoleteComparaison des spécifications
| Paramètre | MPC8313EVRAFFB | MPC8313EVRAGDB |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $42,85 | $17,90 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Part Status | Active | — |
| Core Architecture | PowerPC e300c3 | 32-bit RISC |
| Processor Series | MPC83xx (PowerQUICC II Pro) | MPC83xx (PowerQUICC II Pro) |
| Core Count | 1 | — |
| Largeur du bus de données | 32-bit | 32 bit |
| Maximum CPU Frequency | 333 MHz | — |
| Package Type | 516-TEPBGA (27 mm x 27 mm) with exposed die pad | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Encryption Engine | Yes (AES, DES, 3DES, IPsec) | — |
| Ethernet Controllers | [DATA_NEEDED: ethernet port count and speed] | — |
| Memory Controller | DDR1/DDR2 (up to 256 MB addressable) | DDR1/DDR2 SDRAM |
| PCI Express | [DATA_NEEDED: PCIe lane count] | 2 x PCIe interfaces |
| USB Interface | [DATA_NEEDED: USB revision] | USB 2.0 Host/Device |
| RoHS | Details per manufacturer (status not confirmed by web data snippet) | — |
| Supplier Device Package | 516-TEPBGA | — |
| Core | — | PowerPC e300c3 |
| Maximum CPU Clock | — | 400 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 0.09 um CMOS |
| Supply Voltage - I/O | — | 1.8V / 2.5V / 3.3V |
| Boîtier | — | 516-TEPBGA (27x27 mm) with Exposed Pad |
| Number of Pins/Balls | — | 516 balls |
| Température de fonctionnement | — | -40C to +85C (Industrial) |
| Integrated Ethernet MACs | — | 2 (10/100/1000 Mbps eTSECs) |
| Cryptography Engine | — | Hardware IPsec, AES, DES/3DES, Kasumi |
| Security Enabled | — | Yes (E suffix) |
| Statut RoHS | — | non-compliant per legacy Freescale datasheet |
| Pin/Ball Count | — | 516 |