MPC8313EVRAFFB vs MPC8313EVRAGDB Comparação

Comparação detalhada lado a lado de MPC8313EVRAFFB por NXP Semiconductors e MPC8313EVRAGDB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8313EVRAFFB MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP

MPC8313EVRAFFB - PowerQUICC II Pro e300c3 MPU 333MHz | NXP

MPC8313EVRAFFB ✓ Ativo
NXP Semiconductors
MPC8313EVRAGDB MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors

MPC8313EVRAGDB - PowerQUICC II Pro 400MHz MPU | NXP Semiconductors

MPC8313EVRAGDB Obsolete

Comparação de especificações

Parâmetro MPC8313EVRAFFB MPC8313EVRAGDB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $42,85 $17,90
Manufacturer NXP Semiconductors (formerly Freescale) —
Part Status Active —
Core Architecture PowerPC e300c3 32-bit RISC
Processor Series MPC83xx (PowerQUICC II Pro) MPC83xx (PowerQUICC II Pro)
Core Count 1 —
Largura do barramento de dados 32-bit 32 bit
Maximum CPU Frequency 333 MHz —
Package Type 516-TEPBGA (27 mm x 27 mm) with exposed die pad —
Tipo de montagem Surface Mount (BGA) Surface Mount (BGA)
Faixa de temperatura de operação [DATA_NEEDED: operating temperature range] —
Encryption Engine Yes (AES, DES, 3DES, IPsec) —
Ethernet Controllers [DATA_NEEDED: ethernet port count and speed] —
Memory Controller DDR1/DDR2 (up to 256 MB addressable) DDR1/DDR2 SDRAM
PCI Express [DATA_NEEDED: PCIe lane count] 2 x PCIe interfaces
USB Interface [DATA_NEEDED: USB revision] USB 2.0 Host/Device
RoHS Details per manufacturer (status not confirmed by web data snippet) —
Supplier Device Package 516-TEPBGA —
Core — PowerPC e300c3
Maximum CPU Clock — 400 MHz
Number of Cores — 1
Process Technology — 0.09 um CMOS
Supply Voltage - I/O — 1.8V / 2.5V / 3.3V
Encapsulamento — 516-TEPBGA (27x27 mm) with Exposed Pad
Number of Pins/Balls — 516 balls
Temperatura de operação — -40C to +85C (Industrial)
Integrated Ethernet MACs — 2 (10/100/1000 Mbps eTSECs)
Cryptography Engine — Hardware IPsec, AES, DES/3DES, Kasumi
Security Enabled — Yes (E suffix)
Status RoHS — non-compliant per legacy Freescale datasheet
Pin/Ball Count — 516

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação