MPC8560VTAQFC vs MPC8555EVTAQF Comparación
Comparación detallada lado a lado de MPC8560VTAQFC por NXP Semiconductors y MPC8555EVTAQF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8555EVTAQF - PowerQUICC III 1GHz e500 MPU | NXP 783-FCPBGA
MPC8555EVTAQF ObsoleteComparación de especificaciones
| Parámetro | MPC8560VTAQFC | MPC8555EVTAQF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $178,90 | $92,40 |
| Series | PowerQUICC III (MPC85xx) | PowerQUICC III, MPC85xx |
| Core Processor | PowerPC e500 | — |
| Number of Cores | 1 | — |
| Core Architecture | 32-Bit (64-Bit data bus) | PowerPC e500 |
| Core Frequency | 1.0 GHz | 1.0 GHz |
| Co-Processor / DSP | Communications; CPM | — |
| Supply Voltage - Core | 1.2 V | — |
| RAM Controllers | DDR, SDRAM | — |
| Graphics Acceleration | No | — |
| Package Type | 783-FCPBGA (29x29 mm, 1.0 mm pitch) | FC-PBGA, flip-chip plastic BGA |
| Package Height | 3.75 mm | — |
| Tipo de montaje | Surface Mount (Flip-Chip) | Surface Mount |
| Nivel MSL | 3 (168 Hours) | [DATA_NEEDED: MSL rating] |
| REACH Status | REACH Unaffected | — |
| HTSUS Code | 8542.31.0001 | — |
| Estado RoHS | Lead-Free / Compliant | [DATA_NEEDED: RoHS compliance] |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Manufacturer | — | NXP USA Inc. |
| Core Count | — | 1 |
| Ancho del bus de datos | — | 32-bit |
| Encapsulado | — | 783-FCPBGA (29x29 mm) |
| Recuento de pines | — | 783 |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 1.2 V |
| L1 Cache | — | 32 KB instruction / 32 KB data |