MPC860TVR50D4 vs MPC860TZQ50D4-FR Comparación
Comparación detallada lado a lado de MPC860TVR50D4 por NXP Semiconductors y MPC860TZQ50D4-FR por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC860TVR50D4 | MPC860TZQ50D4-FR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $58,00 | $78,75 |
| Core Architecture | PowerPC 32-bit | PowerPC 32-bit |
| Core Count | 1 | 1 |
| Frecuencia de reloj máxima | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Encapsulado / Carcasa | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | — |
| Instruction Cache | 4 Kbyte | 4 Kbytes |
| Data Cache | 4 Kbyte | 4 Kbytes |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | — |
| Rango de temperatura de funcionamiento | -40°C to +95°C | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Series | MPC8xx PowerQUICC | MPC860 PowerQUICC |
| Estado RoHS | [DATA_NEEDED: rohs compliance] | Non-Compliant |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Operating Frequency | — | 50 MHz |
| Encapsulado | — | 357-PBGA (25 mm x 25 mm) |
| Supply Voltage (I/O) | — | 3.3 V |
| External Data Bus | — | 32-bit |
| Integrated Module | — | CPM (Communications Processor Module) |
| Serial Controllers | — | SCC, SMC, SPI, I2C, HDLC, UART, Ethernet |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Lead Free Status | — | Contains Lead |
| Packaging | — | Tray |
| Estado del ciclo de vida | — | Obsolete (End of Life per NXP product page) |