MPC870VR66 vs MPC875VR133 Comparación
Comparación detallada lado a lado de MPC870VR66 por NXP Semiconductors y MPC875VR133 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC870VR66 | MPC875VR133 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,90 | $27,90 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| Ancho del bus de datos | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | 176 MIPS |
| Tensión de alimentación de funcionamiento | 3.3 V | — |
| Rango de temperatura de funcionamiento | 0C to +95C | — |
| Encapsulado / Carcasa | 256-BGA (PBGA), 23x23 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| Estado RoHS | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Temperatura de funcionamiento | — | 0 °C to +95 °C |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |