MPC870VR66 vs MPC875VR133 Vergleich
Detaillierter Direktvergleich von MPC870VR66 von NXP Semiconductors und MPC875VR133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC870VR66 | MPC875VR133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,90 | $27,90 |
| Manufacturer | NXP Semiconductors | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | PowerQUICC, MPC8xx | PowerQUICC, MPC8xx |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | 1 |
| Datenbusbreite | 32-bit | 32 bit |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | 176 MIPS |
| Betriebsversorgungsspannung | 3.3 V | — |
| Betriebstemperaturbereich | 0C to +95C | — |
| Gehäuse / Bauform | 256-BGA (PBGA), 23x23 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Core Architecture | — | Power Architecture (32-bit RISC) |
| Core Frequency | — | 133 MHz |
| Process Technology | — | 0.18 µm CMOS |
| Supply Voltage (I/O) | — | 3.3 V |
| Betriebstemperatur | — | 0 °C to +95 °C |
| Package Type | — | 256-PBGA (HBGA), 23x23 mm |
| Terminal Pitch | — | 1.27 mm |
| On-chip Communications | — | CPM (HDLC/Sync UART/I²C/SPI), 2x 10/100 Ethernet MII/RMII |
| Memory Controller | — | SDRAM, Flash, SRAM, ROM support |
| PCI Bridge | — | Integrated (PCI 2.1) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |