MPC870ZT133 vs MPC875CVR133 Comparación
Comparación detallada lado a lado de MPC870ZT133 por NXP Semiconductors y MPC875CVR133 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC870ZT133 | MPC875CVR133 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $28,75 | $43,75 |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | — |
| Core Frequency | 133 MHz | — |
| Number of Cores | 1 | 1 |
| External Data Bus Width | 32-bit | — |
| Tensión de alimentación | 3.3 V I/O, 1.8 V core | — |
| Temperatura de funcionamiento | 0C to +95C (commercial) | -40C to +100C |
| Encapsulado / Carcasa | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Free Status | Contains Lead | — |
| Estado RoHS | Non-Compliant (legacy part) | [DATA_NEEDED: rohs status] |
| Packaging | Tray | — |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (Power Architecture Technology) |
| Ancho del bus de datos | — | 32-bit |
| Frecuencia de reloj máxima | — | 133 MHz |
| Performance | — | 176 MIPS |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Encapsulado | — | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) |
| On-chip Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/USB/FEC/ATM) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |