MPC870ZT133 vs MPC875CVR133 Vergleich
Detaillierter Direktvergleich von MPC870ZT133 von NXP Semiconductors und MPC875CVR133 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MPC870ZT133 | MPC875CVR133 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $28,75 | $43,75 |
| Manufacturer | NXP USA Inc. (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Product Family | PowerQUICC MPC8xx | — |
| Processor Type | MPC8xx PowerQUICC, 32-Bit | — |
| Core Architecture | Power Architecture (G2_LE) | — |
| Core Frequency | 133 MHz | — |
| Number of Cores | 1 | 1 |
| External Data Bus Width | 32-bit | — |
| Versorgungsspannung | 3.3 V I/O, 1.8 V core | — |
| Betriebstemperatur | 0C to +95C (commercial) | -40C to +100C |
| Gehäuse / Bauform | 256-PBGA (23 x 23 mm) | — |
| Terminal Form | BALL | — |
| Number of Terminals | 256 | — |
| Package Code | HBGA | — |
| Montageart | Surface Mount | Surface Mount |
| Lead Free Status | Contains Lead | — |
| RoHS-Status | Non-Compliant (legacy part) | [DATA_NEEDED: rohs status] |
| Packaging | Tray | — |
| Product Category | — | Microprocessors (MPU) |
| Processor Series | — | MPC8xx / PowerQUICC |
| Core | — | MPC8xx (Power Architecture Technology) |
| Datenbusbreite | — | 32-bit |
| Maximale Taktfrequenz | — | 133 MHz |
| Performance | — | 176 MIPS |
| Core Supply Voltage | — | 1.8 V |
| I/O Supply Voltage | — | 3.3 V |
| Gehäuse | — | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) |
| On-chip Communication Processor Module (CPM) | — | Yes (FCC/SCC/SMC/USB/FEC/ATM) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |