MPX12DP vs MPXC2011DT1 Comparación

Comparación detallada lado a lado de MPX12DP por NXP Semiconductors y MPXC2011DT1 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MPX12DP MPX12DP - 10kPa Differential Pressure Sensor 4-SIP | NXP

MPX12DP - 10kPa Differential Pressure Sensor 4-SIP | NXP

MPX12DP Obsolete
NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Activo

Comparación de especificaciones

Parámetro MPX12DP MPXC2011DT1
Marca NXP Semiconductors NXP Semiconductors
Categoría Pressure Sensors Pressure Sensors
Estado del ciclo de vida Obsolete Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $9,75 $14,95
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity 5.5 mV/kPa typical 2.5 mV/kPa typical
Full-Scale Span 35 mV typical (20 mV min / 75 mV max) —
Rango de tensión de salida 0 mV to 55 mV at 3 V excitation —
Excitation Voltage 3 V DC typical 3 V DC to 10 V DC (10 V nominal)
Linearity +/-5% of span —
Pressure Port Style Dual axial tube, 4.93 mm (0.19 in) diameter —
Compensation Uncompensated (external required) On-chip temperature compensated and calibrated
Tipo de salida Analog Wheatstone bridge (mV) Analog Wheatstone bridge (ratiometric)
Package / Mounting 4-SIP through-hole module —
Temperatura de funcionamiento -40C to +125C 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Tipo de montaje Through Hole Through-hole (PCB mount with side-port tubing)
Estado RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status not in web data]
Lead Free [DATA_NEEDED: lead-free status] —
Nivel MSL Not applicable (through-hole) —
Full-Scale Output — 25 mV typical at 10 V excitation
Encapsulado — 4-SSIP Chip Pak module, side port
Port Style — Female, 3.25 mm (0.128 in) barbed side port
Termination Style — Through-hole PCB, 4 leads
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

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