MPX12DP vs MPXC2011DT1 Comparaison

Comparaison détaillée côte à côte de MPX12DP par NXP Semiconductors et MPXC2011DT1 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
MPX12DP MPX12DP - 10kPa Differential Pressure Sensor 4-SIP | NXP

MPX12DP - 10kPa Differential Pressure Sensor 4-SIP | NXP

MPX12DP Obsolete
NXP Semiconductors
MPXC2011DT1 MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 - 10kPa Differential Pressure Sensor 4-SSIP | NXP

MPXC2011DT1 ✓ Actif

Comparaison des spécifications

Paramètre MPX12DP MPXC2011DT1
Marque NXP Semiconductors NXP Semiconductors
Catégorie Pressure Sensors Pressure Sensors
Statut du cycle de vie Obsolete Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $9,75 $14,95
Pressure Type Differential Differential
Operating Pressure Range 0 kPa to 10 kPa (0 PSI to 1.45 PSI) 0 kPa to 10 kPa (0 PSI to 1.45 PSI)
Sensitivity 5.5 mV/kPa typical 2.5 mV/kPa typical
Full-Scale Span 35 mV typical (20 mV min / 75 mV max) —
Plage de tension de sortie 0 mV to 55 mV at 3 V excitation —
Excitation Voltage 3 V DC typical 3 V DC to 10 V DC (10 V nominal)
Linearity +/-5% of span —
Pressure Port Style Dual axial tube, 4.93 mm (0.19 in) diameter —
Compensation Uncompensated (external required) On-chip temperature compensated and calibrated
Type de sortie Analog Wheatstone bridge (mV) Analog Wheatstone bridge (ratiometric)
Package / Mounting 4-SIP through-hole module —
Température de fonctionnement -40C to +125C 0 °C to +85 °C
Storage Temperature [DATA_NEEDED: storage temperature] —
Type de montage Through Hole Through-hole (PCB mount with side-port tubing)
Statut RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status not in web data]
Lead Free [DATA_NEEDED: lead-free status] —
Niveau MSL Not applicable (through-hole) —
Full-Scale Output — 25 mV typical at 10 V excitation
Boîtier — 4-SSIP Chip Pak module, side port
Port Style — Female, 3.25 mm (0.128 in) barbed side port
Termination Style — Through-hole PCB, 4 leads
Technology — Piezoresistive silicon strain gauge
Module Dimensions — 7.6 mm x 12.8 mm nominal

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