MPX2100DP vs MPX2010DP Comparación
Comparación detallada lado a lado de MPX2100DP por NXP Semiconductors y MPX2010DP por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPX2100DP | MPX2010DP |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Pressure Sensors | Pressure Sensors |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,95 | $8,50 |
| Pressure Type | Differential | — |
| Operating Pressure Range | 0 kPa to 100 kPa (0 to 14.5 psi) | — |
| Maximum Overload Pressure | [DATA_NEEDED: maximum overload pressure] | — |
| Full-Scale Span (Typical) | 40 mV (at 10 V excitation) | — |
| Zero Pressure Offset | [DATA_NEEDED: zero pressure offset] | 0 mV nominally (±1.0 mV max) |
| Linearity | 1% typical | ±0.05% (typ) |
| Tensión de alimentación | 10 V DC typical | 10 V DC typical (max 16 V) |
| Corriente de alimentación | [DATA_NEEDED: supply current] | — |
| Tipo de salida | Analog mV (Wheatstone Bridge) | Analog voltage, Wheatstone bridge (mV level) |
| Temperatura de funcionamiento | 0C to +85C (compensated) | -40 °C to +125 °C |
| Storage Temperature | [DATA_NEEDED: storage temperature] | — |
| Port Configuration | Dual port, axial tube, 4.93 mm (0.19 in) | Dual ports (differential), 0.19 inch / 4.93 mm tubes |
| Encapsulado / Carcasa | 4-SIP Module (Case 344C-01) | — |
| Tipo de montaje | Through-Hole | — |
| Technology | Silicon piezoresistive, on-chip temperature compensation | Piezoresistive (silicon strain gauge bridge) |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | [DATA_NEEDED: MSL rating] | — |
| Tipo de sensor | — | Differential Pressure Sensor |
| Pressure Range | — | 0 to 10 kPa (0 to 1.45 PSI) |
| Typical Full-Scale Span | — | 25 mV at 10 V excitation |
| Temperature Compensation | — | 0 °C to +85 °C (on-chip) |
| Response Time | — | 1.0 ms (typical) |
| Maximum Overpressure | — | 75 kPa |
| Burst Pressure | — | 200 kPa |
| Package / Mounting | — | 4-SIP Module (through-hole with axial tubes) |
| Media Compatibility | — | Dry air or non-corrosive gas |